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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| XX630A3PCM12 | ETC |
获取价格 |
ultrasonic sensor cylindrical M30 - Sn 8 m - NC NO - M12 connector |
|
| XX630AFPA400MTF | SCHNEIDER |
获取价格 |
Ultrasonic Sensor, |
|
| XX-6501-20TLWR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6501-20WR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6501-21WR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6501-30TLWR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6501-30WR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6501-31WR | ARIES |
获取价格 |
Series 501 Standard DIP Socket w/Bifurcated Contacts & Wire Wrap Pins |
|
| XX-6511-10TLWR | ARIES |
获取价格 |
Series 511 Standard DIP Socket w/Bifurcated Contacts & Solder Pin Tails |
|
| XX-6511-10WR | ARIES |
获取价格 |
Series 511 Standard DIP Socket w/Bifurcated Contacts & Solder Pin Tails |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
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