Datasheet > XSFM12148701F

XSFM12148701F

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
3页	105K
描述
RESISTOR, THIN FILM, 0.25 W, 1 %, 100 ppm, 48700 ohm, SURFACE MOUNT, 0202, CHIP

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XSFM12148701F 数据手册

SFM

Thin Film Top-Contact Resistor

Vishay Electro-Films

CONFIGURATIONS in inches

0.004

0.020

0.007

0.016

0.020

0.006

0.004

0.016

TYPICAL RANGE

820 Ω - 1 MΩ

TYPICAL RANGE

1 Ω - 29 Ω

30 Ω - 819 Ω

SCHEMATIC

MECHANICAL SPECIFICATIONS in inches

PARAMETER

Chip Size

0.020 x 0.020 0.003 (0.5 x 0.5 0.076 mm)

Chip Thickness

Chip Substrate Material

Resistor Material

Bonding Pad Size

Number of Pads

Pad Material

0.010 0.002 (0.254 0.05 mm)

Oxidized silicon, 10 kÅ minimum SiO₂

Tantalum nitride, self-passivating

0.004 x 0.004 (0.10 x 0.10 mm)

25 kÅ minimum aluminum

Backing

None, lapped semiconductor silicon

Options: Gold backing for eutectic die attach

Gold bonding pads, 15 kÅ minimum thickness

Consult Applications Engineer

ORDERING INFORMATION

Example: 100 % visual, 10 kΩ, 1 %, 100 ppm/°C TCR, aluminum pads, class H visual inspection

SFM

PRODUCT

FAMILY

04ꢀ

PROCESS

CODE

1000

RESISTANCE

VALUE

TOLERANCE

CODE

INSPECTION/

PACKAGING

MULTIPLIER

CODE

W = 100 % visually inspected

parts in matrix tray per

MIL-STD-883

X = Sample , commercial

visually inspected parts loaded

in matrix trays (4 % AQL)

See Process Code

table

Use first 4 digits of D = 0.0001

B = 0.1 %

C = 0.2 %

D = 0.5 %

F = 1.0 %

G = 2.0 %

H = 2.5 %

J = 5.0 %

resistance

C = 0.001

B = 0.01

A = 0.1

0 = 1

1 = 10

2 = 100

3 = 1000

4 = 10 000

K = 10 %

*Coating standard

Document Number: 61017

Revision: 12-Mar-08

For technical questions, contact: efi@vishay.com

www.vishay.com

123

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