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XRN772-2005FBGP PDF预览

XRN772-2005FBGP

更新时间: 2024-11-05 04:23:27
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描述
Thin Film Resistor Series

XRN772-2005FBGP 数据手册

  
             
             
                     
                     
CALIFORNIA MICRO DEVICES  
XRN772-XXXX  
Thin Film Resistor Series  
California Micro Devices Hx (Stable Extended Capability  
Chip) Series offer exceptional stability and low noise.  
Available in the standard center tapped configuration,  
they have low electro migration ꢀualities and extremely  
low TCR.  
Electrical Specifications  
Conditions  
Parameter  
TCR  
–55°C to 125°C  
±100ppm  
±5ppm/°C  
100Vdc  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
Ma±  
TTCR  
55°C to 125°C  
55°C to 125°C  
Operating Voltage  
Power Rating  
Deration  
@ 70°C (Derate linearly to zero @ 150°C)  
30°C for 2 years  
125mw  
±0.1%∆  
Thermal Shock  
High Temperature E±posure  
Moisture Resistance  
Life  
Method 107 MIL-STD-202F  
100 Hrs @ 150°C Ambient  
Method 106 MIL-STD-202F  
±0.2%R  
±0.15%  
±0.2%R  
±0.2%R  
Method 108 MIL-STD-202F (125°C/1000 hr)  
Method 308 MIL-STD-202F up to 250KΩ  
250KΩ  
Noise  
35dB  
20dB  
Insulation Resistance  
@25°C  
1 X 1012  
Min  
Values  
Bonding Area  
20Mto 60Mstandard. Standard ratio tolerance between  
resistors = ±1%. Tighter ratio tolerance available.  
R1  
R2  
Laser Code Area  
Mechanical Specifications  
Formats  
Die Size: 60 3 mils sꢀuare  
Bonding Pads: 4x4 mils typical  
Substrate  
Isolation Layer  
Resistor  
Silicon 10±2 mils thick  
Si02 10,000Å thick, min  
Proprietary Silicon Chrome  
Lapped (gold optional)  
20 M  
to 60 M  
Backing  
Bond Pads  
Aluminum 10,000Å thick, min  
Notes  
1. Code bo±es are available for alphanumeric laser  
marking on the chip.  
Packaging  
Two inch sꢀuare trays of 100 chips maximum is standard.  
2. Resistor pattern may vary from one value to another.  
Part Number Designation  
XRN772  
2005  
F
A
G
W
P
Series Resistance Value  
First 3 digits are  
significant  
Tolerance  
TCR  
Bond Pads  
Backing  
Ratio Tolerance  
F = 1%  
No Letter = 100ppm  
G = Gold  
W = Gold  
Std = 1%  
value.  
Last digit  
represents  
No Letter =  
Aluminum  
G = 2%  
A = 50ppm  
L = Lapped  
P = 0.5%  
number of  
zeros.  
R indicates  
decimal point.  
No Letter =  
Either  
J = 5%  
B = 25ppm  
K = 10%  
© 2000 California Micro Devices Corp. All rights reserved.  
C1370800  
8/9/2000  
215 Topaz Street, Milpitas, California 95035  
Tel: (408) 263-3214  
Fax: (408) 263-7846  
www.calmicro.com  
1

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