Datasheet > XR2A-2471-N

XR2A-2471-N

更新时间： 2024-11-03 07:07:23

品牌	Logo	应用领域
欧姆龙 - OMRON		插座
页数	文件大小	规格书
14页	1193K
描述
IC Sockets

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中文翻译

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技术参数
数据手册

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XR2A-2471-N 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8536.69.40.40	Factory Lead Time：	28 weeks 3 days
风险等级：	5.63	联系完成配合：	GOLD (30)
联系完成终止：	GOLD (30)	触点材料：	BERYLLIUM COPPER
设备插槽类型：	IC SOCKET	JESD-609代码：	e4
Base Number Matches：	1

XR2A-2471-N 数据手册

IC Sockets

XR2

OMRON’s IC Connectors Have Excellent

Reliability and Can Tolerate Momentary

Interruptions in Power.

• Round pins and 4-point (4-finger) contact construction with

contact entry holes that are large for easy insertion.

• IC lead contacts placed high for solid connections.

• A wide product range: open-frame, closed-frame, single-

row, carrier-type DIP terminals, wrap terminals, solder-

sleeve terminals, and low-profile DIP terminals.

• Conforms to UL standards (file no. E 103202) and CSA

standards (file no. LR 62678).

■ Construction

■ Contact Dimensions

Base

DIP

Terminals

Wrap

Terminals

Low-profile DIP

Terminals

Solder-sleeve

Terminals

1.83 dia.

Outer sleeve

Carrier

1.35 dia.

0.79 dia.

Inner clip

0.51 dia.

0.635 0.635

Outer sleeve

■ Ratings and Characteristics

■

Applicable Wrap Post Wire Sizes

AWG30, AWG28, AWG26, AWG24

(Solid wire: 0.25 to 0.51 mm dia.)

Item

Gold plated

Gold flash plated

Rated current

Rated voltage

Contact resistance

1 A

300 VAC

20 mΩ max. (at 20 mV, 100 mA max.)

■ Wrap Post Length

Insulation resistance 1,000 MΩ min. (at 500 VDC)

3 wires

Dielectric strength

1,000 VAC for 1 min (leakage current: 1 mA max.)

Contact insertion

(See note.)

400 gf (3.92 N) max.

■ Applicable IC Lead Dimensions

Contact removal

(See note.)

65 gf (0.64 N) min. with gold plating or with solder plating

DIP, Wrap, and Solder-sleeve Terminals

Insertion durability

100 times (0.75-

50 times (0.25-

m gold plating), 20 times

Depth × width (mm)

m gold plating)

Ambient temperature Operating: –55 to 125°C (with no icing)

Flat lead

0.29 ±0.09 × 0.46 ±0.08 (See note.)

0.53 dia. max. 0.41 dia. min.

Round lead

Note: The contact insertion force and contact removal force are for a

test gauge, t = 0.432 mm.

Note: Do not use wire where the diagonal is more than 0.56 mm.

Low-profile DIP Terminals

■ Materials and Finish

Depth × width (mm)

Base

Fiber-glass reinforced PBT resin (UL94V-0)/black

Aluminum

Flat lead

0.29 ±0.09 × 0.46 ±0.08 (See note.)

0.50 dia. max. 0.41 dia. min.

Carrier

Round lead

Inner clip

Outer sleeve

Beryllium copper/nickel base, gold plated

Brass/nickel base, gold flash plating

Note: Do not use wire where the diagonal is more than 0.52 mm.

Note: For non-standard plating, contact your OMRON representative.

IC Sockets XR2

111

12 3 4 5 6 7...14

中文翻译

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