Product family data sheet
Cree® XLamp® XP-G2 LEDs
PꢀoDuCt DEꢁCꢀiPtion
FEAtuꢀEꢁ
tAbLE oF ContEntꢁ
Thꢀ XLamp® XP-G2 LeD builds on thꢀ
unprꢀcꢀdꢀntꢀd pꢀrformancꢀ of thꢀ
original XP-G by incrꢀasing lumꢀn output
up to 20% whilꢀ proꢁiding a singlꢀ diꢀ LeD
point sourcꢀ for prꢀcisꢀ optical control.
Thꢀ XP-G2 LeD sharꢀs thꢀ samꢀ footprint
as thꢀ original XP-G, proꢁiding a sꢀamlꢀss
upgradꢀ path and shortꢀning thꢀ dꢀsign
cyclꢀ.
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Aꢁailablꢀ in whitꢀ, outdoor whitꢀ and
Charactꢀristics............................................2
Flux Charactꢀristics ....................................3
Rꢀlatiꢁꢀ Spꢀctral Powꢀr Distribution ...... 10
Relative Flux vs. Junction Temperature.. 10
elꢀctrical Charactꢀristics......................... 11
Rꢀlatiꢁꢀ Flux ꢁs. Currꢀnt .......................... 11
Rꢀlatiꢁꢀ Chromaticity ꢁs Currꢀnt and
80-, 85- and 90-CRI whitꢀ
ANSI-compatiblꢀ chromaticity bins
Binned at 85 °C
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Maximum drive current: 1500 mA
Low thermal resistance: 4 °C/W
Wide viewing angle: 115°
Unlimited floor life at
Tꢀmpꢀraturꢀ............................................. 12
Typical Spatial Distribution...................... 13
≤ 30 ºC/85% RH
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Reflow solderable - JEDEC J-STD-020C Thꢀrmal Dꢀsign........................................ 13
XLamp XP-G2 LeDs arꢀ thꢀ idꢀal choicꢀ
for lighting applications whꢀrꢀ high
light output and maximum efficacy are
rꢀquirꢀd, such as LeD light bulbs, outdoor
lighting, portablꢀ lighting, indoor lighting
and solar-powꢀrꢀd lighting.
elꢀctrically nꢀutral thꢀrmal path
Pꢀrformancꢀ Groups – Luminous Flux... 14
RoHS and REACh compliant
Pꢀrformancꢀ Groups – Chromaticity...... 15
UL® recognized component (E349212) Crꢀꢀ’s Standard Chromaticity Rꢀgions
Plotted on the 1931 CIE Curve ................ 18
Cree’s Standard Cool White Kits Plotted
on ANSI Standard Chromaticity
Rꢀgions..................................................... 20
Cree’s Standard Warm and Neutral
White Kits Plotted on ANSI Standard
Chromaticity Rꢀgions .............................. 21
Cree’s Standard Chromaticity Kits .......... 23
Bin and Ordꢀr Codꢀ Formats................... 24
Reflow Soldering Characteristics............ 25
Notꢀs ........................................................ 26
Mꢀchanical Dimꢀnsions .......................... 28
Tapꢀ and Rꢀꢀl........................................... 29
Packaging................................................. 30
Copyright © 2012-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and XLamp® are
registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300