是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, BGA357,19X19,50 |
针数: | 357 | Reach Compliance Code: | unknown |
风险等级: | 5.7 | Is Samacsys: | N |
地址总线宽度: | 32 | 位大小: | 32 |
最大时钟频率: | 66 MHz | 外部数据总线宽度: | 32 |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e0 |
长度: | 25 mm | 端子数量: | 357 |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA357,19X19,50 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.05 mm |
速度: | 66 MHz | 子类别: | Other Microprocessor ICs |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC860DECZP33 | MOTOROLA |
获取价格 |
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP33C1 | ETC |
获取价格 |
COMMUNICATIONS CONTROLLER | |
XPC860DECZP50 | MOTOROLA |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP50C1 | MOTOROLA |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP50D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DECZP50D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DECZP66D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DECZP66D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DEZP25 | ETC |
获取价格 |
Communications Controller | |
XPC860DEZP33C1 | MOTOROLA |
获取价格 |
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 |