是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 357 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.11 | Is Samacsys: | N |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 50 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e0 | 长度: | 25 mm |
低功率模式: | YES | 端子数量: | 357 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | NOT SPECIFIED | 认证状态: | Not Qualified |
座面最大高度: | 2.05 mm | 速度: | 50 MHz |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC860DEZP50D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DEZP66 | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 | |
XPC860DEZP66C1 | MOTOROLA |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DEZP66D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DEZP66D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DEZP80D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DEZP80D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DHCZP33 | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 33MHz, CMOS, PBGA357, PLASTIC, BGA-357 | |
XPC860DHCZP33C1 | MOTOROLA |
获取价格 |
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DHCZP50C1 | ETC |
获取价格 |
COMMUNICATIONS CONTROLLER |