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XPC860DHZP33C1 PDF预览

XPC860DHZP33C1

更新时间: 2024-01-02 07:33:19
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 时钟外围集成电路
页数 文件大小 规格书
64页 785K
描述
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357

XPC860DHZP33C1 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:BGA, BGA357,19X19,50Reach Compliance Code:unknown
风险等级:5.89Is Samacsys:N
JESD-30 代码:S-PBGA-B357JESD-609代码:e0
端子数量:357最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA357,19X19,50封装形状:SQUARE
封装形式:GRID ARRAY电源:3.3 V
认证状态:Not Qualified子类别:Other Microprocessor ICs
标称供电电压:3.3 V表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
Base Number Matches:1

XPC860DHZP33C1 数据手册

 浏览型号XPC860DHZP33C1的Datasheet PDF文件第2页浏览型号XPC860DHZP33C1的Datasheet PDF文件第3页浏览型号XPC860DHZP33C1的Datasheet PDF文件第4页浏览型号XPC860DHZP33C1的Datasheet PDF文件第5页浏览型号XPC860DHZP33C1的Datasheet PDF文件第6页浏览型号XPC860DHZP33C1的Datasheet PDF文件第7页 
MPC860EC/D  
(Motorola Order Number)  
10/1999  
REV. 4  
ª
Advance Information  
MPC860 Family Hardware  
SpeciÞcations  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing speciÞcations for the MPC860 family. These same  
speciÞcations also apply to the MPC860P. In this document, the term ÔMPC860Õ generally  
refers to all MPC860 family members including the MPC860P.  
This document contains the following topics:  
Topic  
Page  
Section 1.1, ÒOverviewÓ  
2
Section 1.2, ÒFeaturesÓ  
2
Section 1.3, ÒElectrical and Thermal CharacteristicsÓ  
Section 1.4, ÒThermal CharacteristicsÓ  
Section 1.5, ÒPower ConsiderationsÓ  
5
6
7
Section 1.6, ÒBus Signal TimingÓ  
8
Section 1.7, ÒIEEE 1149.1 Electrical SpeciÞcationsÓ  
Section 1.8, ÒCPM Electrical CharacteristicsÓ  
Section 1.9, ÒMechanical Data and Ordering InformationÓ  
Section 1.10, ÒDocument Revision HistoryÓ  
33  
35  
57  
62  
This document contains information on a new product under development by Motorola. Motorola reserves the right to change or discontinue this product  
without notice.  
© Motorola Inc., 1998. All rights reserved.  

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