是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
包装说明: | BGA, BGA357,19X19,50 | Reach Compliance Code: | unknown |
风险等级: | 5.89 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e0 |
端子数量: | 357 | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA357,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 3.3 V |
认证状态: | Not Qualified | 子类别: | Other Microprocessor ICs |
标称供电电压: | 3.3 V | 表面贴装: | YES |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
XPC860DHZP50C1 | MOTOROLA | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 |
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XPC860DHZP66C1 | MOTOROLA | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 |
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XPC860DPCZP50D3 | MOTOROLA | Family Hardware Specifications |
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XPC860DPCZP50D4 | MOTOROLA | Family Hardware Specifications |
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XPC860DPCZP66D3 | MOTOROLA | Family Hardware Specifications |
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XPC860DPCZP66D4 | MOTOROLA | Family Hardware Specifications |
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