生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 357 |
Reach Compliance Code: | unknown | ECCN代码: | 5A991 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.52 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 最大时钟频率: | 50 MHz |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B357 |
长度: | 25 mm | 端子数量: | 357 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 2.05 mm |
速度: | 50 MHz | 最大供电电压: | 3.465 V |
最小供电电压: | 3.135 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
XPC860DEZP50D3 | MOTOROLA | Family Hardware Specifications |
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XPC860DEZP50D4 | MOTOROLA | Family Hardware Specifications |
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XPC860DEZP66 | MOTOROLA | RISC Microprocessor, 32-Bit, 66MHz, CMOS, PBGA357, PLASTIC, BGA-357 |
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|
XPC860DEZP66C1 | MOTOROLA | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 |
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|
XPC860DEZP66D3 | MOTOROLA | Family Hardware Specifications |
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XPC860DEZP66D4 | MOTOROLA | Family Hardware Specifications |
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