生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, BGA357,19X19,50 | 针数: | 357 |
Reach Compliance Code: | unknown | 风险等级: | 5.5 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 最大时钟频率: | 33 MHz |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B357 |
JESD-609代码: | e0 | 长度: | 25 mm |
端子数量: | 357 | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA357,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.05 mm | 速度: | 33 MHz |
子类别: | Other Microprocessor ICs | 最大供电电压: | 3.6 V |
最小供电电压: | 3 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC860DCZP40 | ETC |
获取价格 |
Communications Controller | |
XPC860DCZP50C1 | MOTOROLA |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DCZP66C1 | MOTOROLA |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP33 | MOTOROLA |
获取价格 |
32-BIT, 33MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP33C1 | ETC |
获取价格 |
COMMUNICATIONS CONTROLLER | |
XPC860DECZP50 | MOTOROLA |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP50C1 | MOTOROLA |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | |
XPC860DECZP50D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DECZP50D4 | MOTOROLA |
获取价格 |
Family Hardware Specifications | |
XPC860DECZP66D3 | MOTOROLA |
获取价格 |
Family Hardware Specifications |