是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | BGA, BGA256,16X16,50 | Reach Compliance Code: | unknown |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.85 | Is Samacsys: | N |
地址总线宽度: | 26 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 40 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B256 |
JESD-609代码: | e0 | 长度: | 23 mm |
低功率模式: | YES | 端子数量: | 256 |
最高工作温度: | 95 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA256,16X16,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 3.3 V |
认证状态: | Not Qualified | 座面最大高度: | 2.35 mm |
速度: | 80 MHz | 子类别: | Microprocessors |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 23 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC850DECVR50BU | NXP |
获取价格 |
32-BIT, 50 MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTI | |
XPC850DECVR66BU | NXP |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC | |
XPC850DECZT50B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT50BU | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | |
XPC850DECZT50BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT50BU | FREESCALE |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT66B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT66BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT66BU | FREESCALE |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DECZT66BU | NXP |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC |