是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | BGA, BGA256,16X16,50 |
针数: | 256 | Reach Compliance Code: | not_compliant |
ECCN代码: | 5A991 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.21 | Is Samacsys: | N |
地址总线宽度: | 26 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 50 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B256 |
长度: | 23 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 256 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA256,16X16,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.35 mm | 速度: | 50 MHz |
子类别: | Microprocessors | 最大供电电压: | 3.465 V |
最小供电电压: | 3.135 V | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | TIN/LEAD/SILVER (SN/PB/AG) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 23 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC850DEZT50BUR2 | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
XPC850DEZT66B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT66BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT66BU | FREESCALE |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT66BU | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | |
XPC850DEZT80B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT80BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT80BU | FREESCALE |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT80BU | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | |
XPC850DSLCVR50BU | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC |