是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | BGA, |
针数: | 256 | Reach Compliance Code: | unknown |
ECCN代码: | 5A991 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.25 | 地址总线宽度: | 26 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 50 MHz | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
长度: | 23 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 256 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 220 | 认证状态: | Not Qualified |
座面最大高度: | 2.35 mm | 速度: | 50 MHz |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 23 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC850DEVR66BU | NXP |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC | |
XPC850DEVR66BUR2 | NXP |
获取价格 |
32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
XPC850DEVR80BU | NXP |
获取价格 |
32-BIT, 80MHz, RISC PROCESSOR, PBGA256, 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, PLASTIC | |
XPC850DEZT50B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT50BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT50BU | FREESCALE |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT50BU | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,256PIN,PLASTIC | |
XPC850DEZT50BUR2 | NXP |
获取价格 |
32-BIT, 50MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | |
XPC850DEZT66B | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications | |
XPC850DEZT66BU | MOTOROLA |
获取价格 |
Communications Controller Hardware Specifications |