5秒后页面跳转
XPC750FRC300E PDF预览

XPC750FRC300E

更新时间: 2024-09-21 18:23:11
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 时钟外围集成电路
页数 文件大小 规格书
1页 31K
描述
32-BIT, 300MHz, RISC PROCESSOR, CPGA288, 1.750 X 2.500 INCH, 2.54 MM PITCH, PGA-288

XPC750FRC300E 技术参数

生命周期:Obsolete零件包装代码:PGA
包装说明:PGA,针数:288
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.74
Is Samacsys:N其他特性:ALSO REQUIRES 3.3 TO 3.465 VOLTS FOR I/O OPERATION
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:300 MHz
外部数据总线宽度:64集成缓存:NO
JESD-30 代码:R-CPGA-P288长度:63.881 mm
低功率模式:YES端子数量:288
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:PGA
封装形状:RECTANGULAR封装形式:GRID ARRAY
认证状态:Not Qualified速度:300 MHz
最大供电电压:2.73 V标称供电电压:2.6 V
表面贴装:NO技术:CMOS
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:PERPENDICULAR宽度:44.704 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISCBase Number Matches:1

XPC750FRC300E 数据手册

  

与XPC750FRC300E相关器件

型号 品牌 获取价格 描述 数据表
XPC750PRX200LX MOTOROLA

获取价格

32-BIT, 200MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMI
XPC750PRX233TX MOTOROLA

获取价格

32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMI
XPC750PRX266LX MOTOROLA

获取价格

RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PI
XPC750PRX300LE MOTOROLA

获取价格

32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX300LE NXP

获取价格

IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC
XPC750PRX300RE NXP

获取价格

32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX333LE MOTOROLA

获取价格

32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX333RE NXP

获取价格

32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX366RE MOTOROLA

获取价格

32-BIT, 366MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX400RE NXP

获取价格

32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI