生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 360 |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.74 |
其他特性: | ALSO REQUIRES 3.3V I/O SUPPLY | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 40 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B360 | 长度: | 25 mm |
低功率模式: | YES | 端子数量: | 360 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
认证状态: | Not Qualified | 座面最大高度: | 3.2 mm |
速度: | 200 MHz | 标称供电电压: | 1.9 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC750PRX233TX | MOTOROLA |
获取价格 |
32-BIT, 233MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX266LX | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PI | |
XPC750PRX300LE | MOTOROLA |
获取价格 |
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX300LE | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC | |
XPC750PRX300RE | NXP |
获取价格 |
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX333LE | MOTOROLA |
获取价格 |
32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX333RE | NXP |
获取价格 |
32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX366RE | MOTOROLA |
获取价格 |
32-BIT, 366MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX400RE | NXP |
获取价格 |
32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750VIM200C | MOTOROLA |
获取价格 |
32-BIT, 200MHz, RISC PROCESSOR, CPGA288 |