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XPC750PRX300LE PDF预览

XPC750PRX300LE

更新时间: 2024-01-10 02:09:27
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 时钟外围集成电路
页数 文件大小 规格书
24页 310K
描述
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

XPC750PRX300LE 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA360,19X19,50
针数:360Reach Compliance Code:unknown
ECCN代码:3A001.A.3HTS代码:8542.31.00.01
风险等级:5.57其他特性:ALSO REQUIRES 3.3V I/O SUPPLY
地址总线宽度:32位大小:32
边界扫描:YES最大时钟频率:100 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-CBGA-B360
JESD-609代码:e0长度:25 mm
低功率模式:YES端子数量:360
最高工作温度:105 °C最低工作温度:
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:BGA
封装等效代码:BGA360,19X19,50封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):NOT SPECIFIED
电源:1.9,3.3 V认证状态:Not Qualified
座面最大高度:3.2 mm速度:300 MHz
子类别:Microprocessors最大供电电压:2 V
最小供电电压:1.8 V标称供电电压:1.9 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:25 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

XPC750PRX300LE 数据手册

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Order Number: XPC750EC/D  
Rev 2, 09/2001  
Semiconductor Products Sector  
Advance Information  
XPC750P RISC Microprocessor  
Hardware Specifications  
This document describes pertinent physical characteristics of the XPC750P, a process-remapped version of  
the MPC750. This part has been previously described jointly with the MPC750 in the MPC750 RISC  
Microprocessor Hardware Specifications (MPC750EC/D Rev 1); however, it is now being described  
separately because the MPC750 is available over much wider operating conditions (including extended  
temperature conditions). The XPC750P described herein will only be available at the restricted operating  
conditions described in Table 3.  
This document describes the XPC750P; however, unless otherwise noted, all information here applies also  
to the XPC740P. The XPC750P and XPC740P are implementations of the PowerPC™ family of reduced  
instruction set computing (RISC) microprocessors. For functional characteristics of the processor, refer to  
the MPC750 RISC Microprocessor User’s Manual.  
The MPC750 family has been implemented in several semiconductor fabrication processes. Different  
processes require different supply voltages and may have other electrical differences. The implementations  
are, in general, functionally equivalent but may represent different revisions of the design with regard to  
errata. A companion document, called a Part Number Specification, is created to describe errata or  
specification variances that are unique to a particular revision. Part Number Specifications, if applicable, are  
available at the same website, http://www.mot.com/PowerPC, where this document is found.  
This document contains information on a new product under development by Motorola.  
Motorola reserves the right to change or discontinue this product without notice.  
© Motorola, Inc., 2001. All rights reserved.  
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE  

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