Datasheet > XPC750PRX300LE

XPC750PRX300LE

更新时间： 2024-01-27 08:34:22

品牌	Logo	应用领域
摩托罗拉 - MOTOROLA		时钟外围集成电路
页数	文件大小	规格书
24页	310K
描述
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

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XPC750PRX300LE 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	BGA, BGA360,19X19,50
针数：	360	Reach Compliance Code：	unknown
ECCN代码：	3A001.A.3	HTS代码：	8542.31.00.01
风险等级：	5.57	其他特性：	ALSO REQUIRES 3.3V I/O SUPPLY
地址总线宽度：	32	位大小：	32
边界扫描：	YES	最大时钟频率：	100 MHz
外部数据总线宽度：	64	格式：	FLOATING POINT
集成缓存：	YES	JESD-30 代码：	S-CBGA-B360
JESD-609代码：	e0	长度：	25 mm
低功率模式：	YES	端子数量：	360
最高工作温度：	105 °C	最低工作温度：
封装主体材料：	CERAMIC, METAL-SEALED COFIRED	封装代码：	BGA
封装等效代码：	BGA360,19X19,50	封装形状：	SQUARE
封装形式：	GRID ARRAY	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	1.9,3.3 V	认证状态：	Not Qualified
座面最大高度：	3.2 mm	速度：	300 MHz
子类别：	Microprocessors	最大供电电压：	2 V
最小供电电压：	1.8 V	标称供电电压：	1.9 V
表面贴装：	YES	技术：	CMOS
温度等级：	OTHER	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	25 mm	uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC
Base Number Matches：	1

XPC750PRX300LE 数据手册

Order Number: XPC750EC/D

Rev 2, 09/2001

Semiconductor Products Sector

™

Advance Information

XPC750P RISC Microprocessor

Hardware Speciﬁcations

This document describes pertinent physical characteristics of the XPC750P, a process-remapped version of

the MPC750. This part has been previously described jointly with the MPC750 in the MPC750 RISC

Microprocessor Hardware Speciﬁcations (MPC750EC/D Rev 1); however, it is now being described

separately because the MPC750 is available over much wider operating conditions (including extended

temperature conditions). The XPC750P described herein will only be available at the restricted operating

conditions described in Table 3.

This document describes the XPC750P; however, unless otherwise noted, all information here applies also

to the XPC740P. The XPC750P and XPC740P are implementations of the PowerPC™ family of reduced

instruction set computing (RISC) microprocessors. For functional characteristics of the processor, refer to

the MPC750 RISC Microprocessor User’s Manual.

The MPC750 family has been implemented in several semiconductor fabrication processes. Different

processes require different supply voltages and may have other electrical differences. The implementations

are, in general, functionally equivalent but may represent different revisions of the design with regard to

errata. A companion document, called a Part Number Speciﬁcation, is created to describe errata or

speciﬁcation variances that are unique to a particular revision. Part Number Speciﬁcations, if applicable, are

available at the same website, http://www.mot.com/PowerPC, where this document is found.

This document contains information on a new product under development by Motorola.

Motorola reserves the right to change or discontinue this product without notice.

PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE

12 3 4 5 6 7...24

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与XPC750PRX300LE相关器件

型号	品牌	获取价格	描述	数据表
XPC750PRX300RE	NXP	获取价格	32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX333LE	MOTOROLA	获取价格	32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX333RE	NXP	获取价格	32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX366RE	MOTOROLA	获取价格	32-BIT, 366MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750PRX400RE	NXP	获取价格	32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI
XPC750VIM200C	MOTOROLA	获取价格	32-BIT, 200MHz, RISC PROCESSOR, CPGA288
XPC750VIM233C	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 233MHz, CMOS, CPGA288
XPC750VIM233E	MOTOROLA	获取价格	32-BIT, 233MHz, RISC PROCESSOR, CPGA288
XPC750VIM266C	MOTOROLA	获取价格	32-BIT, 266MHz, RISC PROCESSOR, CPGA288
XPC750VIM266D	MOTOROLA	获取价格	RISC Microprocessor, 32-Bit, 266MHz, CMOS, CPGA288

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