生命周期: | Obsolete | 包装说明: | BGA, |
Reach Compliance Code: | unknown | ECCN代码: | 3A991.A.2 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.74 |
Is Samacsys: | N | 其他特性: | ALSO REQUIRES 3.3V I/O SUPPLY |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 40 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-B360 |
长度: | 25 mm | 低功率模式: | YES |
端子数量: | 360 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
座面最大高度: | 3.2 mm | 速度: | 233 MHz |
标称供电电压: | 1.9 V | 表面贴装: | YES |
技术: | CMOS | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 25 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
XPC750PRX266LX | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HIEGHT, 1.27 MM PI | |
XPC750PRX300LE | MOTOROLA |
获取价格 |
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX300LE | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,360PIN,CERAMIC | |
XPC750PRX300RE | NXP |
获取价格 |
32-BIT, 300MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX333LE | MOTOROLA |
获取价格 |
32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX333RE | NXP |
获取价格 |
32-BIT, 333MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX366RE | MOTOROLA |
获取价格 |
32-BIT, 366MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750PRX400RE | NXP |
获取价格 |
32-BIT, 400MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMI | |
XPC750VIM200C | MOTOROLA |
获取价格 |
32-BIT, 200MHz, RISC PROCESSOR, CPGA288 | |
XPC750VIM233C | MOTOROLA |
获取价格 |
RISC Microprocessor, 32-Bit, 233MHz, CMOS, CPGA288 |