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XCCACEM16BG388I

更新时间: 2024-11-04 03:14:43
品牌 Logo 应用领域
赛灵思 - XILINX /
页数 文件大小 规格书
29页 311K
描述
System ACE MPM Solution

XCCACEM16BG388I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA388,26X26,50
针数:388Reach Compliance Code:unknown
HTS代码:8542.32.00.71风险等级:5.89
数据保留时间-最小值:20耐久性:1000000 Write/Erase Cycles
JESD-30 代码:S-PBGA-B388长度:35 mm
内存密度:16777216 bit内存集成电路类型:MEMORY CIRCUIT
内存宽度:16湿度敏感等级:1
功能数量:1端子数量:388
字数:1048576 words字数代码:1000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA388,26X26,50封装形状:SQUARE
封装形式:GRID ARRAY并行/串行:SERIAL
峰值回流温度(摄氏度):225电源:1.8,3.3 V
认证状态:Not Qualified座面最大高度:2.87 mm
子类别:Flash Memories最大压摆率:0.24 mA
最大供电电压 (Vsup):1.89 V最小供电电压 (Vsup):1.71 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NOR TYPE宽度:35 mm
Base Number Matches:1

XCCACEM16BG388I 数据手册

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System ACE™ MPM Solution  
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DS087 (v1.2) June 7, 2002  
Advance Product Specification  
Summary  
System level, high capacity, pre-configured solution for  
Virtex™ Series FPGAs, Virtex-II Series Platform  
FPGAs, and Spartan™ FPGAs  
Patented compression technology (up to 2x  
compression)  
JTAG interface allows:  
Industry standard Flash memory die combined with  
Xilinx controller technology in a single package  
-
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Access to the standard Flash memory  
Boundary Scan testing  
Effortless density migration:  
Native interface to the standard Flash memory is  
provided for:  
-
-
-
-
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XCCACEM16-BG388I (16 Megabit (Mb))  
XCCACEM32-BG388I (32 Mb)  
XCCACEM64-BG388I (64 Mb)  
External parallel programming  
Processor access to unused Flash memory  
locations  
All densities are available in the 388-pin Ball Grid Array  
package  
Supports up to eight separate design sets (selectable  
by mode pins or via JTAG), enabling systems to  
reconfigure FPGAs for different functions  
VCC I/O: 1.8V, 2.5V, and 3.3V  
Configuration rates up to 152 Mb per second (Mb/s)  
Flexible configuration solution:  
Compatible with IEEE Standard 1532  
User-friendly software to format and program the  
bitstreams into the standard Flash via the patented  
Flash programming engine  
-
-
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SelectMAP (control up to four FPGAs)  
Slave-Serial  
Concurrent Slave-Serial (up to eight separate  
chains)  
Internet Reconfigurable Logic (IRL) upgradeable  
system  
Description  
The System ACE Multi-Package Module (MPM) solution  
addresses the need for a space-efficient, pre-engineered,  
high-density configuration solution in multiple FPGA sys-  
tems. The System ACE technology is a ground-breaking  
in-system programmable configuration solution that pro-  
vides substantial savings in development effort and cost per  
bit over traditional PROM and embedded solutions for high  
capacity FPGA systems. As shown in Figure 1, the System  
ACE MPM solution is a multi-package module that includes  
the System ACE MPM controller, a configuration PROM,  
and an AMD Flash Memory.  
The native Flash memory interface provides direct read and  
write access to the Flash memory unit. The target FPGA  
interface provides the signals to configure target FPGAs via  
the Slave-Serial, concurrent Slave-Serial, or SelectMAP  
configuration modes.  
Separate power pins provide voltage compatibility control  
for the target FPGA configuration interface and for the sys-  
tem control/status interface.  
See Figure 3 for a complete view of the components and  
schematic of the signals in the System ACE MPM.  
The System ACE MPM has four major interfaces. (See  
Figure 2.) The boundary scan JTAG interface is provided for  
boundary scan test and boundary-scan-based Flash mem-  
ory programming. The system control interface provides an  
input for the system clock, design set selection pins, system  
configuration control signals, and system configuration sta-  
tus signals.  
© 2002 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS087 (v1.2) June 7, 2002  
www.xilinx.com  
1
Advance Product Specification  
1-800-255-7778  

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RES NET,THIN FILM,12K OHMS,100WV,10% +/-TOL,-10,10PPM TC,0505 CASE