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XC2V8000-5FG456C

更新时间: 2024-11-11 07:06:35
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赛灵思 - XILINX /
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318页 2407K
描述
Virtex-II Platform FPGAs: Complete Data Sheet

XC2V8000-5FG456C 数据手册

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Virtex-II Platform FPGAs:  
Complete Data Sheet  
DS031 (v3.5) November 5, 2007  
Product Specification  
Module 1:  
Introduction and Overview  
Module 3:  
DC and Switching Characteristics  
7 pages  
43 pages  
Summary of Features  
General Description  
Architecture  
Device/Package Combinations and Maximum I/O  
Ordering Examples  
Electrical Characteristics  
Performance Characteristics  
Switching Characteristics  
Pin-to-Pin Output Parameter Guidelines  
Pin-to-Pin Input Parameter Guidelines  
DCM Timing Parameters  
Source-Synchronous Switching Characteristics  
Module 2:  
Functional Description  
Module 4:  
Pinout Information  
41 pages  
Detailed Description  
226 pages  
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Input/Output Blocks (IOBs)  
Digitally Controlled Impedance (DCI)  
Configurable Logic Blocks (CLBs)  
18-Kb Block SelectRAM™ Resources  
18-Bit x 18-Bit Multipliers  
Global Clock Multiplexer Buffers  
Digital Clock Manager (DCM)  
Pin Definitions  
Pinout Tables  
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CS144/CSG144 Chip-Scale BGA Package  
FG256/FGG256 Fine-Pitch BGA Package  
FG456/FGG456 Fine-Pitch BGA Package  
FG676/FGG676 Fine-Pitch BGA Package  
BG575/BGG575 Standard BGA Package  
BG728/BGG728 Standard BGA Package  
FF896 Flip-Chip Fine-Pitch BGA Package  
FF1152 Flip-Chip Fine-Pitch BGA Package  
FF1517 Flip-Chip Fine-Pitch BGA Package  
BF957Flip-Chip BGA Package  
Routing  
Creating a Design  
Configuration  
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision  
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.  
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other  
trademarks are the property of their respective owners.  
DS031 (v3.5) November 5, 2007  
www.xilinx.com  
Product Specification  
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