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XBP24-AWI-080

更新时间： 2022-09-29 18:25:28

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XBP24-AWI-080 数据手册

PCB design and manufacturing

Flux and cleaning

We recommend that you use a “no clean” solder paste in assembling these devices. This eliminates

the clean step and ensures that you do not leave unwanted residual flux under the device where it is

difficult to remove. In addition:

Cleaning with liquids can result in liquid remaining under the device or in the gap between the

device and the host PCB. This can lead to unintended connections between pads.

The residual moisture and flux residue under the device are not easily seen during an

inspection process.

Rework

CAUTION! Any modification to the device voids the warranty coverage and certifications.

Rework should never be performed on the module itself. The module has been optimized to give the

best possible performance, and reworking the module itself will void warranty coverage and

certifications. We recognize that some customers will choose to rework and void the warranty; the

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

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