Datasheet > XBP24-AWI-080

XBP24-AWI-080

更新时间： 2022-09-29 18:25:28

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
180页	2660K
描述
RF TXRX MODULE 802.15.4 WIRE ANT

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XBP24-AWI-080 数据手册

PCB design and manufacturing

Recommended solder reflow cycle

The following table provides the recommended solder reflow cycle. The table shows the temperature

setting and the time to reach the temperature; it does not show the cooling cycle.

Time (seconds)

Temperature (degrees C)

100

135

160

195

240

260

120

150

180

210

The maximum temperature should not exceed 260 °C.

The device will reflow during this cycle, and therefore must not be reflowed upside down. Take care

not to jar the device while the solder is molten, as this can remove components under the shield from

their required locations.

Hand soldering is possible and should be performed in accordance with approved standards.

The device has a Moisture Sensitivity Level (MSL) of 3. When using this product, consider the relative

requirements in accordance with standard IPC/JEDEC J-STD-020.

In addition, note the following conditions:

a. Calculated shelf life in sealed bag: 12 months at < 40 °C and < 90% relative humidity (RH).

b. Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD-

033C, paragraphs 5 through 7.

c. The time between the opening of the sealed bag and the start of the reflow process cannot

exceed 168 hours if condition b) is met.

d. Baking is required if conditions b) or c) are not met.

e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.

f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at

125 °C.

Recommended footprint and keepout

We recommend that you use the following PCB footprints for surface-mounting. The dimensions

without brackets are in inches, and those in brackets are in millimeters.

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

177

1...174 175 176177178 179 180

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