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XBP24-AWI-080

更新时间： 2022-09-29 18:25:28

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XBP24-AWI-080 数据手册

PCB design and manufacturing

Recommended footprint and keepout

While the underside of the module is mostly coated with solder resist, we recommend that the copper

layer directly below the module be left open to avoid unintended contacts. Copper or vias must not

interfere with the three exposed RF test points on the bottom of the module (see below).

Furthermore, these modules have a ground plane in the middle on the back side for shielding

purposes, which can be affected by copper traces directly below the module.

XBee/XBee-PRO S2C 802.15.4 RF Module User Guide

178

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