5秒后页面跳转
XBP24-API-001 PDF预览

XBP24-API-001

更新时间: 2024-10-28 22:48:03
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
180页 2660K
描述
RF TXRX MOD 802.15.4 TRACE ANT

XBP24-API-001 数据手册

 浏览型号XBP24-API-001的Datasheet PDF文件第174页浏览型号XBP24-API-001的Datasheet PDF文件第175页浏览型号XBP24-API-001的Datasheet PDF文件第176页浏览型号XBP24-API-001的Datasheet PDF文件第178页浏览型号XBP24-API-001的Datasheet PDF文件第179页浏览型号XBP24-API-001的Datasheet PDF文件第180页 
PCB design and manufacturing  
Recommended solder reflow cycle  
Recommended solder reflow cycle  
The following table provides the recommended solder reflow cycle. The table shows the temperature  
setting and the time to reach the temperature; it does not show the cooling cycle.  
Time (seconds)  
Temperature (degrees C)  
30  
65  
60  
100  
135  
160  
195  
240  
260  
90  
120  
150  
180  
210  
The maximum temperature should not exceed 260 °C.  
The device will reflow during this cycle, and therefore must not be reflowed upside down. Take care  
not to jar the device while the solder is molten, as this can remove components under the shield from  
their required locations.  
Hand soldering is possible and should be performed in accordance with approved standards.  
The device has a Moisture Sensitivity Level (MSL) of 3. When using this product, consider the relative  
requirements in accordance with standard IPC/JEDEC J-STD-020.  
In addition, note the following conditions:  
a. Calculated shelf life in sealed bag: 12 months at < 40 °C and < 90% relative humidity (RH).  
b. Environmental condition during the production: 30 °C /60% RH according to IPC/JEDEC J-STD-  
033C, paragraphs 5 through 7.  
c. The time between the opening of the sealed bag and the start of the reflow process cannot  
exceed 168 hours if condition b) is met.  
d. Baking is required if conditions b) or c) are not met.  
e. Baking is required if the humidity indicator inside the bag indicates a RH of 10% more.  
f. If baking is required, bake modules in trays stacked no more than 10 high for 4-6 hours at  
125 °C.  
Recommended footprint and keepout  
We recommend that you use the following PCB footprints for surface-mounting. The dimensions  
without brackets are in inches, and those in brackets are in millimeters.  
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide  
177  
 
 

与XBP24-API-001相关器件

型号 品牌 获取价格 描述 数据表
XBP24-API-001J ETC

获取价格

RF TXRX MOD 802.15.4 TRACE ANT
XBP24-ASI-001 ETC

获取价格

RF TXRX MODULE 802.15.4 RP-SMA
XBP24-ASI-001J ETC

获取价格

RF TXRX MODULE 802.15.4 RP-SMA
XBP24-AUI-001 ETC

获取价格

RF TXRX MODULE 802.15.4 U.FL ANT
XBP24-AUI-001J ETC

获取价格

RF TXRX MODULE 802.15.4 U.FL ANT
XBP24-AUI-080 ETC

获取价格

RF TXRX MODULE 802.15.4 U.FL ANT
XBP24-AWI-001 ETC

获取价格

RF TXRX MODULE 802.15.4 WIRE ANT
XBP24-AWI-001J ETC

获取价格

RF TXRX MODULE 802.15.4 WIRE ANT
XBP24-AWI-080 ETC

获取价格

RF TXRX MODULE 802.15.4 WIRE ANT
XBP24BZ7SITB003 DCD

获取价格

Embedded RF modules provide low-cost, low-power wireless connectivity using the ZigBee PRO