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XBCR02716700B PDF预览

XBCR02716700B

更新时间： 2024-11-02 06:11:23
品牌 Logo 应用领域
威世 - VISHAY 电阻器
页数 文件大小 规格书
3页 98K
描述
Fixed Resistor, Thin Film, 0.25W, 1670ohm, 75V, 0.1% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP

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XBCR02716700B 技术参数

生命周期：Active包装说明：CHIP
Reach Compliance Code：unknownECCN代码：EAR99
风险等级：5.67安装特点：SURFACE MOUNT
端子数量：2最高工作温度：175 °C
最低工作温度：-55 °C封装形状：RECTANGULAR PACKAGE
包装方法：TRAY额定功率耗散 (P)：0.25 W
额定温度：70 °C电阻：1670 Ω
电阻器类型：FIXED RESISTOR尺寸代码：0202
子类别：Fixed Resistors表面贴装：YES
技术：THIN FILM温度系数：100 ppm/ °C
端子形状：ONE SURFACE容差：0.1%
工作电压：75 VBase Number Matches：1

XBCR02716700B 数据手册

 浏览型号XBCR02716700B的Datasheet PDF文件第2页浏览型号XBCR02716700B的Datasheet PDF文件第3页 
BCR  
Vishay Electro-Films  
Thin Film, Back-Contact Resistor  
FEATURES  
• Wire bondable  
Product may not  
be to scale  
• Only one wire bond required  
• Small size: 0.020 inches square.  
• Resistance range: 10 Ω to 1 MΩ  
• Oxidized silicon substrate for good power dissipation  
• Resistor material: Tantalum nitride, self-passivating  
• Moisture resistant  
The Back Contact Resistor (BCR) series single-value  
back-contact resistor chip is one of the smallest chips available.  
The BCR requires only one wire bond thus saving hybrid space.  
The BCRs are manufactured using Vishay Electro-Films  
(EFI) sophisticated thin film equipment and manufacturing  
technology. The BCRs are 100 % electrically tested and  
visually inspected to MIL-STD-883.  
APPLICATIONS  
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by  
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the  
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting  
the resistor to the bottom of the chip.)  
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES  
Tightest Standard Tolerance Available  
PROCESS CODE  
2 % ꢀ %  
1 % 0.2 % 0.ꢀ %  
0.1 %  
CLASS H*  
CLASS K*  
056  
ꢀ2 ꢁꢁmꢂ/C  
010  
20 ꢁꢁmꢂ/C  
002  
061  
100 ꢁꢁmꢂ/C  
027  
059  
ꢀ20 ꢁꢁmꢂ/C  
008  
052  
*MIL-PRF-38534 inspection criteria  
360 kΩ  
1 MΩ  
6ꢀ0 kΩ  
ꢀ00 kΩ  
10 Ω ꢀ0 Ω 20 Ω 100 Ω ꢀ00 Ω 1 kΩ  
STANDARD ELECTRICAL SPECIFICATIONS  
PARAMETER  
Noise, MIL-STD-ꢀ0ꢀ, Method 308  
100 Ω - ꢀ20 kΩ  
< 100 Ω or > ꢀ21 kΩ  
- 35 dB typ.  
- 20 dB typ.  
Moisture resistance, MIL-STD-ꢀ0ꢀ  
Method 106  
0.5 % max. ΔR/R  
Stability, 1000 h, + 1ꢀ2 /C, 1ꢀ2 mW  
1.0 % max. ΔR/R  
Oꢁerating Temꢁerature Range  
- 55 °C to + 125 °C  
Thermal Shock, MIL-STD-ꢀ0ꢀ,  
Method 107, Test Condition F  
0.25 % max. ΔR/R  
High Temꢁerature Exꢁosure, + 120 /C, 100 h  
Dielectric Voltage Breakdown  
0.5 % max. ΔR/R  
200 V  
Insulation Resistance  
1012 min.  
Oꢁerating Voltage  
75 V max.  
DC Power Rating at + 70 /C (Derated to Zero at + 172 /C)  
2 x Rated Power Short-Time Overload, + ꢀ2 /C, 2 s  
250 mW  
0.25 % max. ΔR/R  
www.vishay.com  
54  
For technical questions, contact: efi@vishay.com  
Document Number: 61023  
Revision: 12-Mar-08  
123

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