Datasheet > XB1009-BD

XB1009-BD

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
MIMIX		缓冲放大器
页数	文件大小	规格书
7页	273K
描述
14.0-30.0 GHz GaAs MMIC Buffer Amplifier

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XB1009-BD 数据手册

14.0-30.0 GHz GaAs MMIC

Buffer Amplifier

February 2007 - Rev 05-Feb-07

B1009-BD

0.483

1.084

Mechanical Drawing

(0.019)

(0.043)

1.330

(0.052)

0.620

(0.024)

0.498

(0.020)

0.0

0.468

1.070

1.600

(0.063)

0.0

(0.018)

(0.042)

(Note: Engineering designator is 20MPA5007)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All DC Bond Pads (except Vd3) are 0.100 x 0.100 (0.004 x 0.004). All RF Bond Pads (and Vd3) are 0.100 x 0.200 (0.004 x 0.008)

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 1.319 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Vd1)

Bond Pad #3 (Vd2)

Bond Pad #4 (RF Out)

Bond Pad #5 (Vg1)

Bond Pad #6 (Vg2)

Bias Arrangement

Vd2

Vd1

Bypass Capacitors - See App Note [2]

RF In

RF Out

Vg2

Vg1

Page 4 of 7

Mimix Broadband, Inc., 10795 Rockley Rd., Houston,Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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