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XA6SLX75-2CSG484Q PDF预览

XA6SLX75-2CSG484Q

更新时间: 2024-01-30 01:16:41
品牌 Logo 应用领域
赛灵思 - XILINX 可编程逻辑
页数 文件大小 规格书
10页 288K
描述
Field Programmable Gate Array,

XA6SLX75-2CSG484Q 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:,Reach Compliance Code:compliant
ECCN代码:3A991.DHTS代码:8542.39.00.01
Factory Lead Time:12 weeks风险等级:5.59
JESD-609代码:e1湿度敏感等级:3
峰值回流温度(摄氏度):260可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
端子面层:TIN SILVER COPPER处于峰值回流温度下的最长时间:30
Base Number Matches:1

XA6SLX75-2CSG484Q 数据手册

 浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第3页浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第4页浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第5页浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第7页浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第8页浏览型号XA6SLX75-2CSG484Q的Datasheet PDF文件第9页 
XA Spartan-6 Automotive FPGA Family Overview  
speed and efficiency of many applications, even beyond digital signal processing, such as wide dynamic bus shifters,  
memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The accumulator can also be  
used as a synchronous up/down counter. The multiplier can perform barrel shifting.  
Input/Output  
The number of I/O pins varies from 132 to 328, depending on device and package size. Each I/O pin is configurable and can  
comply with a large number of standards, using up to 3.3V. The Spartan-6 FPGA SelectIO Resources User Guide describes  
the I/O compatibilities of the various I/O options. With the exception of supply pins and a few dedicated configuration pins,  
all other package pins have the same I/O capabilities, constrained only by certain banking rules. All user I/O is bidirectional;  
there are no input-only pins.  
All I/O pins are organized in four banks. Each bank has several common V  
output supply-voltage pins, which also  
CCO  
powers certain input buffers. Some single-ended input buffers require an externally applied reference voltage (V  
). There  
REF  
are several dual-purpose V  
-I/O pins in each bank. In a given bank, when I/O standard calls for a V  
voltage, each V  
REF  
REF  
REF  
pin in that bank must be connected to the same voltage rail and can not be used as an I/O pin.  
I/O Electrical Characteristics  
Single-ended outputs use a conventional CMOS push/pull output structure, driving High towards V  
or Low towards  
CCO  
ground, and can be put into high-Z state. Many I/O features are available to the system designer to optionally invoke in each  
I/O in their design, such as weak internal pull-up and pull-down resistors, strong internal split-termination input resistors,  
adjustable output drive-strengths and slew-rates, and differential termination resistors. See the Spartan-6 FPGA SelectIO  
Resources User Guide for more details on available options for each I/O standard.  
I/O Logic  
Input and Output Delay  
This section describes the available logic resources connected to the I/O interfaces. All inputs and outputs can be configured  
as either combinatorial or registered. Double data rate (DDR) is supported by all inputs and outputs. Any input or output can  
be individually delayed by up to 256 increments. This is implemented as IODELAY2. The identical delay value is available  
either for data input or output. For a bidirectional data line, the transfer from input to output delay is automatic. The number  
of delay steps can be set by configuration and can also be incremented or decremented while in use.  
Because these tap delays vary with supply voltage, process, and temperature, an optional calibration mechanism is built into  
each IODELAY2:  
For source synchronous designs where more accuracy is required, the calibration mechanism can (optionally)  
determine dynamically how many taps are needed to delay data by one full I/O clock cycle, and then programs the  
IODELAY2 with 50% of that value, thus centering the I/O clock in the middle of the data eye.  
A special mode is available only for differential inputs, which uses a phase-detector mechanism to determine whether  
the incoming data signal is being accurately sampled in the middle of the eye. The results from the phase-detector logic  
can be used to either increment or decrement the input delay, one tap at a time, to ensure error-free operation at very  
high bit rates.  
ISERDES and OSERDES  
Many applications combine high-speed bit-serial I/O with slower parallel operation inside the device. This requires a  
serializer and deserializer (SerDes) inside the I/O structure. Each input has access to its own deserializer (serial-to-parallel  
converter) with programmable parallel width of 2, 3, or 4 bits. Where differential inputs are used, the two serializers can be  
cascaded to provide parallel widths of 5, 6, 7, or 8 bits. Each output has access to its own serializer (parallel-to-serial  
converter) with programmable parallel width of 2, 3, or 4 bits. Two serializers can be cascaded when a differential driver is  
used to give access to bus widths of 5, 6, 7, or 8 bits.  
When distributing a double data rate clock, all SerDes data is actually clocked in/out at single data rate to eliminate the  
possibility of bit errors due to duty cycle distortion. This faster single data rate clock is either derived via frequency  
multiplication in a PLL, or doubled locally in each IOB by differentiating both clock edges when the incoming clock uses  
double data rate.  
DS170 (v1.3) December 13, 2012  
www.xilinx.com  
Product Specification  
6
 
 

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