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XA9572XL-10TQG100I PDF预览

XA9572XL-10TQG100I

更新时间: 2024-01-07 04:14:21
品牌 Logo 应用领域
赛灵思 - XILINX 输入元件可编程逻辑
页数 文件大小 规格书
4页 61K
描述
Flash PLD, 10ns, 72-Cell, CMOS, PQFP100, TQFP-100

XA9572XL-10TQG100I 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFP
包装说明:LFQFP, QFP100,.63SQ,20针数:100
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.55
其他特性:YES系统内可编程:YES
JESD-30 代码:S-PQFP-G100JESD-609代码:e3
JTAG BST:YES长度:14 mm
湿度敏感等级:3专用输入次数:
I/O 线路数量:72宏单元数:72
端子数量:100最高工作温度:85 °C
最低工作温度:-40 °C组织:0 DEDICATED INPUTS, 72 I/O
输出函数:MACROCELL封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装等效代码:QFP100,.63SQ,20
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:2.5/3.3,3.3 V
可编程逻辑类型:FLASH PLD传播延迟:10 ns
认证状态:Not Qualified筛选级别:AEC-Q100
座面最大高度:1.6 mm子类别:Programmable Logic Devices
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

XA9572XL-10TQG100I 数据手册

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XA9500XL High-Performance  
CPLD Automotive XA Product  
Family  
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0
0
DS108-1 (v1.5) September 29, 2005  
Preliminary Product Specification  
data sheet (DS056) for pin tables  
Features  
Xilinx received TS 16949 Certification in March 2005.  
AEC-Q100 device qualification and full PPAP support  
available in both extended temperature Q-grade and  
I-grade.  
Description  
The XA9500XL 3.3V CPLD Automotive XA product family is  
targeted for leading-edge, high-performance automotive  
applications that require either automotive industrial (–40°C  
to +85°C ambient) or extended (–40°C to +125°C ambient)  
temperature reconfigurable devices.  
Guaranteed to meet full electrical specifications over  
TA = –40°C to +125°C (Q-grade)  
System frequency up to 100 MHz (10 ns)  
Available in small footprint packages  
Optimized for high-performance 3.3V systems  
-
5V tolerant I/O pins accept 5V, 3.3V, and 2.5V  
signals — ideal for multi-voltage system interfacing  
and level shifting  
Power Estimation  
Power dissipation in CPLDs can vary substantially depend-  
ing on the system frequency, design application and output  
loading. To help reduce power dissipation, each macrocell  
in the XA9500XL device can be configured for low-power  
mode (from the default high-performance mode). In addi-  
tion, unused product-terms and macrocells are automati-  
cally deactivated by the software to further conserve power.  
-
Technology: 0.35µm CMOS process  
Advanced system features  
-
In-system programmable enabling higher system  
reliability through reduced handling and reducing  
production programming times  
-
Superior pin-locking and routability with  
FastCONNECT™ II switch matrix allowing for  
multiple design iterations without board re-spins  
Input hysteresis on all user and boundary-scan pin  
inputs to reduce noise on input signals  
Bus-hold circuitry on all user pin inputs which  
reduces cost associated with pull-up resistors and  
reduces bus loading  
For a general estimate of ICC, the following equation may be  
used:  
ICC (mA) = MCHP(0.5) + MCLP(0.3) + MC(0.0045 mA/MHz) f  
where:  
-
-
MCHP = Macrocells in high-performance (default)  
mode  
-
Full IEEE Standard 1149.1 boundary-scan (JTAG)  
for in-system device testing  
MCLP = Macrocells in low-power mode  
MC = Total number of macrocells used  
f = Clock frequency (MHz)  
·
Fast concurrent programming  
Slew rate control on individual outputs for reducing EMI  
generation  
This calculation is based on typical operating conditions  
using a pattern of 16-bit up/down counters in each Function  
Block with no output loading. The actual ICC value varies  
with the design application and should be verified during  
normal system operation.  
Refer to XC9500XL Family data sheet (DS054) for  
architecture description  
Refer to XC9536XL data sheet (DS058), the  
XC9572XL data sheet (DS057), and the XC95144XL  
Table 1: XA9500XL Device Family  
Device Temperature Grade  
XA9536XL  
Macrocells  
Usable Gates  
800  
Registers  
f
SYSTEM (MHz)  
I, Q  
I, Q  
I
36  
72  
36  
72  
100  
100  
100  
XA9572XL  
1,600  
XA95144XL  
144  
3,200  
144  
© 2005 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.  
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.  
DS108-1 (v1.5) September 29, 2005  
www.xilinx.com  
1
Preliminary Product Specification  

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