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X3N170 PDF预览

X3N170

更新时间: 2024-01-27 12:43:43
品牌 Logo 应用领域
CALOGIC 开关晶体管
页数 文件大小 规格书
2页 22K
描述
Small Signal Field-Effect Transistor, 0.03A I(D), 25V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET

X3N170 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.90.00.00风险等级:5.76
配置:SINGLE最小漏源击穿电压:25 V
最大漏极电流 (Abs) (ID):0.03 A最大漏极电流 (ID):0.03 A
最大漏源导通电阻:200 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):1.3 pFJESD-30 代码:X-XUUC-N3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:UNSPECIFIED
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):0.8 W
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

X3N170 数据手册

 浏览型号X3N170的Datasheet PDF文件第2页 
N-Channel Enhancement  
Mode MOSFET Switch  
CORPORATION  
3N170 / 3N171  
FEATURES  
HANDLING PRECAUTIONS  
Low Switching Voltages  
Fast Switching Times  
Low Drain-Source Resistance  
Low Reverse Transfer Capacitance  
MOS field-effect transistors have extremely high input  
resistance and can be damaged by the accumulation of  
excess static charge. To avoid possible damage to the device  
while wiring, testing, or in actual operation, follow the  
procedures outlined below.  
PIN CONFIGURATION  
1. To avoid the build-up of static charge, the leads of the  
devices should remain shorted together with a metal ring  
except when being tested or used.  
2. Avoid unnecessary handling. Pick up devices by the case  
instead of the leads.  
TO-72  
3. Do not insert or remove devices from circuits with the  
power on as transient voltages may cause permanent  
damage to the devices.  
ABSOLUTE MAXIMUM RATINGS  
(TA = 25oC unless otherwise specified)  
Drain-Gate Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35V  
Drain-Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V  
Gate-Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35V  
Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA  
Storage Temperature Range . . . . . . . . . . . . . -65oC to +200oC  
Operating Temperature Range . . . . . . . . . . . -55oC to +150oC  
Lead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oC  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mW  
Derate above 25oC . . . . . . . . . . . . . . . . . . . . . . . 2.4mW/oC  
C,B  
D
S
G
1003  
NOTE: Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device. These are  
stress ratings only and functional operation of the device at these or  
any other conditions above those indicated in the operational sections  
of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
ORDERING INFORMATION  
Part  
Package  
Temperature Range  
3N170-71  
X3N170-71 Sorted Chips in Carriers  
Hermetic TO-72  
-55oC to +150oC  
-55oC to +150oC  

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