Approval sheet
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical
robustness testing procedure for electronic components" and under standard atmospheric conditions according
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :
Temperature: 15°C to 35°C.
Relative humidity: 45% to 75%.
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).
All soldering tests are performed with midly activated flux.
TEST
PROCEDURE
REQUIREMENT
Dimension
Resistance
The resistance should be
within specified tolerance per
resistance value!
Clause 4.4.2
WW25R
Natural resistance change per change in degree centigrade.
Temperature Coefficient of
Resistance(T.C.R)
Refer to
“QUICK REFERENCE DATA”
R2 R
106 (ppm/C) t1 : 20°C+5°C-1°C
1
Clause 4.8
R
1t2 t1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Permanent resistance change after a 2 second application of a
voltage 2.5 times RCWC or the maximum operation current
specified in the above list, whichever is less.
no visible damage
Short time overload (S.T.O.L)
Clause 4.13
R/R max. ±(1%+0.0001)
Un-mounted chips completely immersed for 10±0.5 second in a
SAC solder bath at 260℃±5ºC
no visible damage
Resistance to soldering
heat(R.S.H)
R/R max. ±(1%+0.0001)
IEC 60068-2-58: 2004
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ASC_WW25R_V11
Nov -2023