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WW25RR007JTL PDF预览

WW25RR007JTL

更新时间: 2024-10-29 17:00:15
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
8页 874K
描述
2512(6432), 0.007Ω, ±5%, 2W

WW25RR007JTL 数据手册

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Approval sheet  
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)  
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category  
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp  
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.  
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical  
robustness testing procedure for electronic components" and under standard atmospheric conditions according  
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :  
Temperature: 15°C to 35°C.  
Relative humidity: 45% to 75%.  
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).  
All soldering tests are performed with midly activated flux.  
TEST  
PROCEDURE  
REQUIREMENT  
Dimension  
Resistance  
The resistance should be  
within specified tolerance per  
resistance value!  
Clause 4.4.2  
WW25R  
Natural resistance change per change in degree centigrade.  
Temperature Coefficient of  
Resistance(T.C.R)  
Refer to  
“QUICK REFERENCE DATA”  
R2 R  
106 (ppm/C) t1 : 20°C+5°C-1°C  
1
Clause 4.8  
R
1t2 t1   
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
Permanent resistance change after a 2 second application of a  
voltage 2.5 times RCWC or the maximum operation current  
specified in the above list, whichever is less.  
no visible damage  
Short time overload (S.T.O.L)  
Clause 4.13  
R/R max. ±(1%+0.0001)  
Un-mounted chips completely immersed for 10±0.5 second in a  
SAC solder bath at 260±5ºC  
no visible damage  
Resistance to soldering  
heat(R.S.H)  
R/R max. ±(1%+0.0001)  
IEC 60068-2-58: 2004  
Page 6 of 8  
ASC_WW25R_V11  
Nov -2023  

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