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WW25BR006JTL PDF预览

WW25BR006JTL

更新时间: 2024-10-29 17:00:15
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
7页 268K
描述
2512(6432), 0.006Ω, ±5%, 3W

WW25BR006JTL 数据手册

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Approval sheet  
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)  
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category  
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp  
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.  
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical  
robustness testing procedure for electronic components" and under standard atmospheric conditions according  
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :  
Temperature: 15°C to 35°C.  
Relative humidity: 45% to 75%.  
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).  
All soldering tests are performed with midly activated flux.  
TEST  
PROCEDURE  
Natural resistance change per change in degree centigrade.  
R2 R  
REQUIREMENT  
Temperature  
Coefficient of  
Resistance(T.C.R)  
Refer to  
“QUICK REFERENCE DATA”  
106 (ppm/C) t1 : 20°C+5°C-1°C  
1
R
1t2 t1  
Clause 4.8  
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature +155°C  
Permanent resistance change after a 5second application of 5 no visible damage  
times rated power  
Short time overload  
(S.T.O.L)  
IEC60115-1  
J: R/R max. ±(2%+0.5m)  
F: R/R max. ±(1%+0.5m)  
Clause 4.13  
Un-mounted chips completely immersed for 10±1second in a  
SAC solder bath at 260±5ºC  
no visible damage  
Resistance to soldering  
heat (R.S.H)  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
good tinning (>95% covered)  
no visible damage  
Clause 4.18  
Un-mounted chips completely immersed for 3±0.5second in a  
SAC solder bath at 235±5℃  
Solderability  
Clause 4.17  
no visible damage  
Temperature cycling  
30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30  
minutes at +155C3C, 2~3 minutes at 20°C+5°C-1°C, total 5  
continuous cycles  
Clause 4.19  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber no visible damage  
Load life (endurance)  
controller 70±2ºC, 1.5 hours on and 0.5 hours off  
Clause 4.25  
J: R/R max. ±(3%+0.5m)  
F: R/R max. ±(1%+0.5m)  
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity no visible damage  
Load life in Humidity  
chamber controller at 40C2C and 90~95% relative humidity,  
1.5hours on and 0.5 hours off  
Clause 4.24  
J: R/R max. ±(3%+0.5m)  
F: R/R max. ±(1%+0.5m)  
Pressurizing force: 1Kg, Test time: 60±1sec.  
Adhesion  
No remarkable damage or  
removal of the terminations  
Clause 4.32  
Bending strength  
no visible damage  
Bending 2mm on 90mm FR4 PCB  
J: R/R max. ±(1%+0.5m)  
F: R/R max. ±(0.5%+0.5m)  
Page 6 of 7  
ASC_WW25B_V03  
JUN - 2020  

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