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WW10XR562FTL PDF预览

WW10XR562FTL

更新时间: 2024-10-29 16:58:31
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
7页 216K
描述
1210(3225), 0.562Ω, ±1%, 1/3W

WW10XR562FTL 数据手册

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Approval sheet  
CATALOGUE NUMBERS  
The resistors have a catalogue number starting with .  
WW10  
Size code  
WW10: 1210  
X
R100  
J
T
L
Type code  
X : Thick film,  
Resistance code – 4 digits  
R100 = 0.1 OHM  
Tolerance  
J: ± 5%  
F: ± 1%  
Packaging code  
Termination code  
T: 7” Reeled taping L = Sn base (lead free)  
R976 = 0.976 OHM  
Reeled tape packaging : 8mm width paper taping 5000pcs per 7” reel.  
TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)  
Essentially all tests are carried out according to the schedule of IEC publication 115-8, category  
LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp  
heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.  
The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical  
robustness testing procedure for electronic components" and under standard atmospheric conditions according  
to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :  
Temperature: 15°C to 35°C.  
Relative humidity: 45% to 75%.  
Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).  
All soldering tests are performed with midly activated flux.  
TEST  
PROCEDURE  
REQUIREMENT  
Refer to  
Natural resistance change per change in degree centigrade.  
Temperature Coefficient  
of Resistance(T.C.R)  
“QUICK REFERENCE DATA”  
R2 R  
×106 (ppm/°C)  
t1 : 20°C+5°C-1°C  
1
Clause 4.8  
R
(
t2 t1  
)
1
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
Permanent resistance change after a 5second application of a  
voltage 2.5 times RCWV or the maximum overload current  
specified in the above list, whichever is less.  
Short time overload  
(S.T.O.L)  
Clause 4.13  
R/R max. ±(2%+0.001)  
Resistance to soldering  
heat(R.S.H)  
Clause 4.18  
Un-mounted chips completely immersed for 10±1 second in a  
SAC solder bath at 260±5ºC  
no visible damage  
R/R max.±(1%+0.001)  
Un-mounted chips completely immersed for 2±0.5 second in a  
SAC solder bath at 235±5℃  
Solderability  
Clause 4.17  
good tinning (>95% covered)  
no visible damage  
30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30  
minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5  
continuous cycles  
no visible damage  
Temperature cycling  
Clause 4.19  
R/R max. ±(1%+0.001)  
1000 +48/-0 hours, loaded with RCWV or Vmax in chamber  
controller 70±2ºC, 1.5 hours on and 0.5 hours off  
Load life (endurance)  
Clause 4.25  
R/R max. ± (5%+0.001)  
R/R max. ± (5%+0.001)  
1000 +48/-0 hours, loaded with RCWV or Vmax in humidity  
chamber controller at 40°C±2°C and 90~95% relative  
humidity, 1.5hours on and 0.5 hours off  
Load life in Humidity  
Clause 4.24  
Page 5 of 7  
ASC_WW10X_V07  
Sep.- 2011  

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