Approval sheet
TEST AND REQUIREMENTS(AEC Q200)
TEST PROCEDURE
REQUIREMENT
Temperature Coefficient Natural resistance change per change in degree centigrade. Refer to
of Resistance(T.C.R)
“QUICK REFERENCE
DATA”
R2 R
R
1t2 t1
106 (ppm/C) t1 : 25°C
1
Clause 4.8
R1 : Resistance at reference temperature 25°C
R2 : Resistance at test temperature 155°C
High temperature
exposure
Test 1000 hrs./ @T=155℃/ Un-powered.
J: R/R max. ±(3%+0.5m)
F: R/R max. ±(1%+0.5m)
no visible damage
Measurement at 24±2 hours after test conclusion.
MIL-STD-202-Method
108
Temperature cycling
JESD22 Method
JA-104
30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30 J: R/R max. ±(1%+0.5m)
minutes at +125C3C, 2~3 minutes at 20°C+5°C-1°C, 1000
cycles
F: R/R max.
±(0.5%+0.5m) no visible
damage
Moisture resistance
Test 65℃/ 80~100%RH/ 10Cycles(t=24hrs/cycle).
J: R/R max. ±(1%+0.5m)
F: R/R max.
±(0.5%+0.5m) no visible
MIL-STD-202-Method
106
Measurement at 24±2 hours after test conclusion.
damage
Bias Humidity
Test 1000 hours/ @85℃/85% RH./ 10% of operation power.
J: R/R max. ±(3%+0.5m)
F: R/R max. ±(1%+0.5m)
no visible damage
MIL-STD-202-Method
103
Measurement at 24±2 hours after test conclusion.
Operation life
Test 1000 hrs./ TA=125℃ / 35% of operating power.
J: R/R max. ±(3%+0.5m)
F: R/R max. ±(1%+0.5m)
no visible damage
MIL-STD-202-Method
108
Measurement at 24±2 hours after test conclusion.
External visual
Electrical test not required. Inspect device construction,
marking and workmanship
no visible damage and
marking follow spec
MIL-STD-883-Method
2009
Physical dimensions
JESD22 Method
JB-100
The chip dimension (L, W, C, D, T) prescribed in the detail
specification shall be checked by Protech 2.5D.
Within spec defined
Mechanic shock
Test Peak value:100g's / Wave: Hail-sine / Duration:6ms /
Velocity:12.3ft/sec.
no visible damage and
within specified tolerance
MIL-STD-202-Method
213
Vibration
Test 5g’s for 20min., 12 cycles each of 3 orientations
J: R/R max. ±(1%+0.5m)
F: R/R max.
±(0.5%+0.5m) no visible
MIL-STD-202-Method
204
damage
Resistance to soldering
heat(R.S.H)
Un-mounted chips completely immersed for 10±1 second in a
SAC solder bath at 270℃±5ºC
J: R/R max. ±(1%+0.5m)
F: R/R max.
MIL-STD-202-Method
210
±(0.5%+0.5m) no visible
damage
Thermal shock
Test -55 to 155℃/ dwell time 15min/ Max transfer time 20sec/
300cycles
J: R/R max. ±(1%+0.5m)
F: R/R max.
±(0.5%+0.5m) no visible
MIL-STD-202-Method
107
damage
Page 7 of 9
ASC_WWxxW_J_AUTO_V04
Dec – 2023