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WW02CR022JAL PDF预览

WW02CR022JAL

更新时间: 2024-10-29 16:58:51
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
8页 188K
描述
0201(0603), 0.022Ω, ±5%, 1/10W

WW02CR022JAL 数据手册

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Approval sheet  
TEST AND REQUIREMENTS  
TEST  
PROCEDURE  
REQUIREMENT  
Temperature  
Coefficient of  
Resistance  
( TCR )  
Natural resistance change per change in degree  
centigrade.  
Test temperature –55 ~ +125°C  
As defined in P.3  
R2 R  
×106 (ppm/°C)  
1
R
(
t2 t1  
)
1
R1 : Resistance at reference temperature  
R2 : Resistance at test temperature  
t1 : 25°C  
Short time  
Permanent resistance change after 2 second application  
R/R max. ±1%  
overload ( STOL ) of a current 2.5 times RCWC specified.  
no visible damage  
Sub-Clause 4.13  
Resistance to  
soldering heat  
Un-mounted chips 10±0.5 seconds, 260±5ºC  
no visible damage  
R/R max. ±1%  
Sub-clause 4.18  
Solderability  
Termination Sn base (lead free) : Un-mounted chip good tinning (>95% covered)  
completely immersed in a lead free solder bath,  
235°C±5°C, 2±0.5 sec  
Sub-clause 4.17  
no visible damage  
Temperature  
cycling  
no visible damage  
1. 30 minutes at -55°C±3°C,  
2. 2~3 minutes at room temperature,  
3. 30 minutes at +125°±3°C,  
R/R max. ±1%  
Sub-clause 4.19  
4. 2~3 minutes at room temperature,  
Total 5 continuous cycles  
Load life  
(endurance)  
70±2ºC, 1000 hours, loaded with rated current,  
1.5 hours on and 0.5 hours off  
R/R max. ±5%  
no visible damage  
Sub-clause 4.25.1  
Steady state in  
Humidity  
1000hrs without current applied in humidity chamber  
R/R max. ±5%  
controller at 40°C±2°C and 90~95% relative humidity  
no visible damage  
Sub-clause 4.24  
Bending strength  
Sub-clause 4.33  
Resistors mounted on a 90mm glass epoxy resin  
PCB(FR4); bending : 3 mm,  
R/R max. ±1%  
no visible damage  
No visible damage  
Adhesion  
5N, 10±1s ( WW02C: 3N)  
Sub-clause 4.32  
Page 6 of 8  
ASC_WWxxC_V07  
Jan 2014  

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