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WS512K32

更新时间: 2024-11-30 22:13:31
品牌 Logo 应用领域
其他 - ETC 静态存储器
页数 文件大小 规格书
11页 613K
描述
512K X 32 SRAM MODULE SMD 5962-94611

WS512K32 数据手册

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WS512K32-XXX  
512Kx32 SRAM MODULE, SMD 5962-94611  
FEATURES  
n Access Times of 15*, 17, 20, 25, 35, 45, 55ns  
n Commercial, Industrial and Military Temperature Ranges  
n TTL Compatible Inputs and Outputs  
n 5 Volt Power Supply  
n Packaging  
• 66 pin, PGA Type, 1ꢀ075" square, Hermetic Ceramic HIP  
(Package400)ꢀ  
n Low Power CMOS  
• 68 lead, 40mm Hermetic Low Profile CQFP, 3ꢀ5mm (0ꢀ140")  
n Built-in Decoupling Caps and Multiple Ground Pins for Low  
(Package 502)1, Package to be developedꢀ  
Noise Operation  
• 68 lead, Hermetic CQFP (G2T)1, 22ꢀ4mm (0ꢀ880") square  
(Package 509) 4ꢀ57mm (0ꢀ180") heightꢀ  
Designed to fit JEDEC 68 lead 0ꢀ990" CQFJ footprint (Figꢀ 3)ꢀ  
• 68 lead, Hermetic CQFP (G1U), 23ꢀ9mm (0ꢀ940") square  
(Package 519) 3ꢀ57mm (0ꢀ140") heightꢀ  
Designed to fit JEDEC 68 lead 0ꢀ990" CQFJ footprint (Figꢀ 3)ꢀ  
n Weight  
WS512K32-XH1X - 13 grams typical  
WS512K32-XG2TX1 - 8 grams typical  
WS512K32-XG1UX - 5 grams typical  
WS512K32-XG1TX - 5 grams typical  
WS512K32-XG4TX1 - 20 grams typical  
• 68 lead, Hermetic CQFP (G1U), 23ꢀ9mm (0ꢀ940") square  
(Package 524) 4ꢀ06mm (0ꢀ160") heightꢀ  
* 15ns Access Time available only in Commercial and Industrial Temperatureꢀ  
This speed is not fully characterized and is subject to change without noticeꢀ  
n Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8  
Note 1: Package Not Recommended For New Design  
FIGꢀ 1 PIN CONFIGURATION FOR WS512K32N-XH1X  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31 Data Inputs/Outputs  
A0-18  
WE1-4  
CS1-4  
OE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
VCC  
GND  
NC  
Not Connected  
BLOCK DIAGRAM  
November 2001 Revꢀ 9  
1
WhiteElectronicDesignsCorporation•(602)437-1520•wwwꢀwhiteedcꢀcom  

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