Datasheet > WQCW1608Z0K1N8PB

WQCW1608Z0K1N8PB

更新时间： 2024-10-29 16:59:23

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	240K
描述
SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 1.8, 16, 700mA

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中文翻译

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数据手册

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WQCW1608Z0K1N8PB 数据手册

RELIABILITY PERFORMANCE

No.

Item

Test condition

Requirements

High

1000 hrs. at rated operating temperature (e.g. 125°C part

can be stored for 1000 hrs. @ 125°C. Same applies fo r

105°C and 85°C. Unpowered.

Measurement at 24±4 hours after test conclusion.

1000 cycles (-40°C to +125°C). Note: If 85°C part o r

105°C part the 1000 cycles will be at that temperat ure.

Measurement at 24±4 hours after test conclusion. 30min

maximum dwell time at each temperature extreme. 1 min.

maximum transition time.

Temperature

Exposure

(Storage)

MIL-STD-202 Method 108

Temperature

Cycle

JESD22

Method JA-104

1000 hours 85°C/85%RH. Unpowered.

Biased Humidity

Operation Life

MIL-STD-202 Method 103

MIL-PRF-27

Measurement at 24±4 hours after test conclusion.

1000 hrs. @ 105°C. If 85°C or 125°C part will be te sted at

that temperature.

Measurement at 24±4 hours after test conclusion.

Method 213. Condition C,

Peak Value: 100g’s, Duration: 6ms, Waveform: Half-sine

Velocity Change: 12.3ft/sec

Mechanical

Shock

MIL-STD-202 Method 213

MIL-STD-202 Method 204

MIL-STD-202 Method 210

5g's for 20 minutes, 12 cycles each of 3 orientations.

Note: Use 8"X5" PCB, .031" thick, 7 secure points on one

long side and 2 secure points at corners of opposite sides.

Parts mounted within 2" from any secure point. Test from

10-2000 Hz.

Condition B No pre-heat of samples. Note: Single Wave

Solder - Procedure 2 for SMD and Procedure 1 for Leaded

with solder within 1.5mm of device body.

Vibration

Resistance to

Solder Heat

Passive Component Human Body Model (HBM)

Electrostatic Discharge (ESD) Test.

Only direct contact discharge, record the voltage value

what the sample can pass.

AEC-Q200-002

ISO/DIS10605

ESD

For both Leaded & SMD. Electrical Test not required.

Magnification 50X. Conditions:

Leaded: Method A @ 235°C, category 3. SMD:

a) Method B, 4 hrs @ 155°C dry heat @ 235°C

b) Method B @ 215°C category 3.

Solderability

J-STD-002

UL-94

c) Method D category 3 @ 260°C.

Flammability

Board Flex

V-0 or V-1 Acceptable

60 sec minimum holding time.

Force of 900g for 60 seconds.

AEC-Q200-005

AEC-Q200-006

Terminal Strength

(SMD)

Page 5 of 7

ASC_WQCW1608 Series_Auto

Nov. 2018

1 2 3 456 7

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与WQCW1608Z0K1N8PB相关器件

型号	品牌	获取价格	描述	数据表
WQCW1608Z0K2N1PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 2.1, 20, 700mA
WQCW1608Z0K2N2PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 2.2, 20, 700mA
WQCW1608Z0K3N3PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 3.3, 20, 700mA
WQCW1608Z0K3N6PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 3.6, 22, 700mA
WQCW1608Z0K3N9PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 3.9, 22, 700mA
WQCW1608Z0K4N3PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 4.3, 22, 700mA
WQCW1608Z0K4N7PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 4.7, 20, 700mA
WQCW1608Z0K5N1PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 5.1, 20, 700mA
WQCW1608Z0K5N6PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 5.6, 15, 700mA
WQCW1608Z0K6N1PB	WALSIN	获取价格	SMD Wire Wound Ceramic Chip RF Inductor(AEC-Q200) / WQCW Series 6.1, 25, 700mA

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