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WQBD1608K2U182TP PDF预览

WQBD1608K2U182TP

更新时间: 2024-10-29 17:00:15
品牌 Logo 应用领域
华新科技 - WALSIN /
页数 文件大小 规格书
11页 2279K
描述
SMD Ferrite Chip Bead (AEC-Q200)/ WQBD Series 220, 500mA

WQBD1608K2U182TP 数据手册

 浏览型号WQBD1608K2U182TP的Datasheet PDF文件第5页浏览型号WQBD1608K2U182TP的Datasheet PDF文件第6页浏览型号WQBD1608K2U182TP的Datasheet PDF文件第7页浏览型号WQBD1608K2U182TP的Datasheet PDF文件第8页浏览型号WQBD1608K2U182TP的Datasheet PDF文件第9页浏览型号WQBD1608K2U182TP的Datasheet PDF文件第10页 
Approval Sheet  
Test item  
ESD  
Test condition  
Classification Levels 1C  
Criteria  
1. No mechanical damage  
2. Impedance value should be  
within ± 30 % of the initial value  
1. More than 95 % of terminal  
electrode should be covered with  
new solder  
1000 V (DC) to < 2000 V (DC)  
1. Solder temperature : 235 ± 5℃  
2. Flux : Rosin  
Solderability Test  
Board Flex  
3. DIP time : 5 ± 1 sec  
2. No mechanical damage  
Epoxy-PCB(1.6mm)  
Deflection 2mm(min)  
No mechanical damage.  
60s minimum holding time  
Size  
Apply Force(F) Test Time  
Terminal Strength  
1005  
1608  
2012  
5N  
10 ±1 sec  
10 ±1 sec  
60 ±1 sec  
No mechanical damage  
10 N  
17.7 N  
LAND PATTERNS FOR REFLOW SOLDERING  
SOLDER LAND INFORMATION  
Unit: mm (inches)  
Size  
1005  
1608  
2012  
3216  
A
B
C
1.2 1.4  
(0.047 0.055)  
1.8 2.0  
(0.071 0.079)  
3.0 4.0  
(0.118 0.157)  
4.2 5.2  
(0.165 0.205)  
0.4  
(0.016)  
0.7  
(0.028)  
1.2  
(0.047)  
2.0  
(0.079)  
0.5  
(0.020)  
0.7  
(0.028)  
1.0  
(0.039)  
1.2  
(0.047)  
Page 11 of 11  
ASC_ WQBD1005- 3216 Series  
Nov - 2019  

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