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WPB4001-1E PDF预览

WPB4001-1E

更新时间: 2024-11-05 20:44:47
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 256K
描述
N-Channel Power MOSFET 500V, 26A, 0.26 Ohm, TO-3P-3L, TO-3P-3L, 30-TUBE

WPB4001-1E 技术参数

是否无铅: 不含铅生命周期:Lifetime Buy
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.74
JESD-609代码:e3端子面层:Tin (Sn)
Base Number Matches:1

WPB4001-1E 数据手册

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Ordering number : ENA2212  
WPB4001  
N-Channel Power MOSFET  
http://onsemi.com  
Ω
500V, 26A, 0.26 , TO-3P-3L  
Features  
ON-resistance R (on)=0.2 (typ.)  
Input capacitance Ciss=2250pF (typ.)  
10V Drive  
Ω
DS  
TO-3P-3L  
Specications  
at Ta=25°C  
Absolute Maximum Ratings  
Parameter  
Symbol  
Conditions  
Ratings  
Unit  
V
Drain to Source Voltage  
V
500  
±30  
26  
DSS  
Gate to Source Voltage  
V
V
GSS  
Drain Current (DC)  
I
A
D
Drain Current (Pulse)  
I
DP  
PW 10 s, duty cycle 1%  
90  
A
μ
Source to Drain Diode Forward Current (DC)  
Source to Drain Diode Forward Current (Pulse)  
I
26  
A
SD  
I
PW 10 s, duty cycle 1%  
90  
A
μ
SDP  
2.5  
220  
150  
W
W
Allowable Power Dissipation  
P
D
Tc=25 C  
°
Channel Temperature  
Storage Temperature  
Tch  
C
C
°
Tstg  
--55 to +150  
°
1
Avalanche Energy (Single Pulse) *  
E
543  
14  
mJ  
A
AS  
2
Avalanche Current *  
I
AV  
Note : 1 V =50V, L=5mH, I =14A (Fig.1)  
*
DD  
2 L 5mH, single pulse  
AV  
*
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating  
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.  
at Ta=25°C  
Electrical Characteristics  
Ratings  
typ  
Parameter  
Symbol  
Conditions  
=10mA, V =0V  
Unit  
min  
500  
max  
Drain to Source Breakdown Voltage  
Zero-Gate Voltage Drain Current  
Gate to Source Leakage Current  
Cutoff Voltage  
V
I
V
μA  
nA  
V
(BR)DSS  
D
GS  
I
I
V
V
V
V
=400V, V =0V  
GS  
100  
DSS  
DS  
GS  
DS  
DS  
=±30V, V =0V  
DS  
±100  
5
GSS  
V
(off)  
GS  
=10V, I =1mA  
3
D
Forward Transfer Admittance  
Static Drain to Source On-State Resistance  
Input Capacitance  
| yfs |  
(on)  
=10V, I =13A  
7.5  
15.5  
0.20  
2250  
450  
90  
S
D
R
I
=13A, V =10V  
D GS  
0.26  
Ω
DS  
Ciss  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
Output Capacitance  
Coss  
Crss  
V
=30V, f=1MHz  
DS  
Reverse Transfer Capacitance  
Turn-ON Delay Time  
t
t
t
t
(on)  
44  
d
r
Rise Time  
156  
224  
94  
See Fig.2  
Turn-OFF Delay Time  
(off)  
d
f
Fall Time  
Total Gate Charge  
Qg  
87  
Gate to Source Charge  
Gate to Drain “Miller” Charge  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Qgs  
Qgd  
V
=200V, V =10V, I =26A  
GS  
15.2  
50  
DS  
D
V
I =26A, V =0V  
1.1  
1.5  
SD  
S
GS  
t
115  
340  
ns  
nC  
See Fig.3  
rr  
I
=26A, V =0V, di/dt=100A/ s  
μ
SD GS  
Q
rr  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 4 of this data sheet.  
Semiconductor Components Industries, LLC, 2013  
September, 2013  
91813 TKIM TC-00002976 No. A2212-1/5  

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