Datasheet > WL610AB-B02-T

WL610AB-B02-T

更新时间： 2024-11-06 04:39:39

品牌	Logo	应用领域
富士康 - FOXCONN		PC 连接器
页数	文件大小	规格书
1页	67K
描述
PCB Connector

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中文翻译

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技术参数
数据手册

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WL610AB-B02-T 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.31	连接器类型：	PCB CONNECTOR
联系完成配合：	GOLD (20) OVER PALLADIUM NICKEL	联系完成终止：	GOLD (20) OVER PALLADIUM NICKEL
触点材料：	COPPER ALLOY	DIN 符合性：	NO
IEC 符合性：	NO	JESD-609代码：	e4
MIL 符合性：	NO	选件：	GENERAL PURPOSE
Base Number Matches：	1

WL610AB-B02-T 数据手册

SPECIFICATIONS

SIM card Conn.

WL Series

Mechanical

Normal Force: 0.3N min

Durability: 5000 Cycles

SIM Card, SMT Type

1.50mm [.059”] Height

6 Pos.

Electrical

Voltage Rating: 15 V max

Current Rating: 0.5 A

Contact Resistance: 100 mΩ max at 10mA.

Dielectric Withstanding Voltage: 540V AC/1 min.

Insulation Resistance: 1000 MΩ min (initial), 100 MΩ min (final),

Physical

Insert molding: THERMOPLASTIC UL 94V-0, Color Black

Contact: Copper Alloy

Plating: See “ORDERING INFORMATION”

Operating Temperature: -30℃ to +85℃

DRAWING

ORDERING INFORMATION

PRODUCT NO.: WL 6 15 A

3- B02 -TR

SIM Card Conn.

Package And Solder Tail Type

= Tray

TR= Tape & Reel

1F= Tray (Lead Free)

7F= Tape & Reel (Lead Free)

No. Contact

6= 6 Pin

8= 8 Pin

Modification Code

Code No.: 2 or 3 Code(A~Z or 0~9)

Body Height

05= 2.5mm

06=2.6mm

07=0.7mm

08=2.8mm

10=1.0mm

11=1.1mm

Upper Cover Type

Contact Area Plating Thickness

A= Upper Cover B= Slider In Type

1= Gold Flash

A= 10u" Pd/Ni +Gold Plating

C= Hinge Type

D= Metal Hook or Cover Type

2= 20u" Gold Plating B= 20u" Pd/Ni +Gold Plating

3= 30u" Gold Plating C= 30u" Pd/Ni +Gold Plating

6= 10u" Gold Plating D= 40u" Pd/Ni +Gold Plating

7= 15u" Gold Plating L= 25u" Pd/Ni +Gold Plating

E= Metal Cover with Push-Push F= Pogo Pin Type

G= Metal Cover with Inject&Door H= Compression Type

90=9.0mm

All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

中文翻译

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