Datasheet > WL605B2-F06-1F

WL605B2-F06-1F

更新时间： 2024-11-06 13:27:11

品牌	Logo	应用领域
富士康 - FOXCONN		PC 连接器
页数	文件大小	规格书
1页	73K
描述
PCB Connector, LEAD FREE

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中文翻译

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技术参数
数据手册

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WL605B2-F06-1F 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	LEAD FREE
Reach Compliance Code：	unknown	风险等级：	5.6
Is Samacsys：	N	连接器类型：	PCB CONNECTOR
联系完成配合：	GOLD (20)	联系完成终止：	GOLD (20)
触点材料：	COPPER ALLOY	DIN 符合性：	NO
IEC 符合性：	NO	JESD-609代码：	e4
MIL 符合性：	NO	选件：	GENERAL PURPOSE
Base Number Matches：	1

WL605B2-F06-1F 数据手册

SPECIFICATIONS

SIM card Conn.

WL Series

Mechanical

Normal Force: 0.3N min

Durability: 5000 Cycles

SIM Card, SMT Type

2.50mm [.098”] Height

6 Pos.

Electrical

Voltage Rating: 15 V max

Current Rating: 0.5 A max

Contact Resistance: 100 mΩ max at 10mA.

Dielectric Withstanding Voltage: 540V AC/1 min.

Insulation Resistance: 1000 MΩ min (initial), 100 MΩ min (final),

Physical

Insert molding: THERMOPLASTIC UL 94V-0, Color Black

Contact: Copper Alloy

Plating: See “ORDERING INFORMATION”

Operating Temperature: -30℃ to +85℃

DRAWING

ORDERING INFORMATION

PRODUCT NO.: WL 6 25 A

3- F06 - TR

SIM Card Conn.

Package And Solder Tail Type

= Tray

TR= Tape & Reel

1F= Tray (Lead Free)

7F= Tape & Reel (Lead Free)

No. Contact

6= 6 Pin

8= 8 Pin

Modification Code

Code No.: 2 or 3 Code(A~Z or 0~9)

Body Height

05= 2.5mm

06=2.6mm

07=0.7mm

08=2.8mm

10=1.0mm

11=1.1mm

Upper Cover Type

Contact Area Plating Thickness

A= Upper Cover B= Slider In Type

1= Gold Flash

A= 10u" Pd/Ni +Gold Plating

C= Hinge Type

D= Metal Hook or Cover Type

2= 20u" Gold Plating B= 20u" Pd/Ni +Gold Plating

3= 30u" Gold Plating C= 30u" Pd/Ni +Gold Plating

6= 10u" Gold Plating D= 40u" Pd/Ni +Gold Plating

7= 15u" Gold Plating L= 25u" Pd/Ni +Gold Plating

E= Metal Cover with Push-Push F= Pogo Pin Type

G= Metal Cover with Inject&Door H= Compression Type

90=9.0mm

All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.

中文翻译

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