WF1M32B-XXX3
White Electronic Designs
1Mx32 3.3V Flash Module
FEATURES
ꢀ
Access Times of 100, 120, 150ns
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Boot Code Sector Architecture (Bottom)
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Packaging
Low Power CMOS, 1.0mA Standby
Embedded Erase and Program Algorithms
Built-in Decoupling Caps for Low Noise Operation
Erase Suspend/Resume
• 66 pin, PGA Type, 1.185" square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, Low Profile CQFP (G2T), 4.6mm
(0.180") square (Package 509)
• Supports reading data from or programing data to
a sector not being erased
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1,000,000 Erase/Program Cycles
Sector Architecture
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Low Current Consumption
Typical values at 5MHz:
• One 16KByte, two 8KBytes, one 32KByte, and
fifteen 64kBytes in byte mode
• 40mA Active Read Current
• 80mA Program/Erase Current
Weight
• Any combination of sectors can be concurrently
erased. Also supports full chip erase
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Organized as 1Mx32
WF1M32B-XG2TX3 -8 grams typical
WF1M32B-XHX3 -13 grams typical
Commercial, Industrial and Military Temperature
Ranges
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3.3 Volt for Read and Write Operations
Note: For programming information refer to Flash Programming 8M3 Application Note.
PIN CONFIGURATION FOR WF1M32B-XHX3
Top View
Pin Description
I/O0-31
A0-19
WE#
Data Inputs/Outputs
Address Inputs
Write Enable
1
12
23
34
45
56
I/O
I/O
8
RESET#
CS
I/O15
I/O14
I/O13
I/O12
OE#
I/O24
I/O25
I/O26
V
CC
I/O31
I/O30
I/O29
I/O28
CS1-4#
OE#
Chip Selects
9
2
#
CS
4#
Output Enable
I/O10
GND
I/O11
NC
RESET# Reset
VCC
GND
NC
Power Supply
A
A
A
A
A
14
16
11
0
A7
I/O27
Ground
A
A
A
V
10
A
12
NC
13
A4
A5
A6
A1
A2
A3
Not Connected
9
A17
15
CC
WE#
A
Block Diagram
18
I/O
I/O
I/O
I/O
7
6
5
4
A
8
I/O16
I/O17
I/O18
NC
CS
I/O23
I/O22
I/O21
I/O20
CS1#
CS2#
CS3#
CS4#
RESET#
WE#
I/O
I/O
I/O
0
1
2
CS1
#
3#
OE#
A0-19
A19
GND
I/O19
1M x 8
1M x 8
1M x 8
1M x 8
I/O
3
11
22
33
44
55
66
8
8
8
8
I/O16-23
I/O24-31
I/O0-7
I/O8-15
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
March 2006
Rev. 5
1
White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com