Datasheet > WED8LM32129C-55EIT

WED8LM32129C-55EIT

更新时间： 2024-11-22 09:49:43

品牌	Logo	应用领域
WEDC		静态存储器
页数	文件大小	规格书
6页	154K
描述
SRAM Module, 128KX32, 55ns, CMOS, CQFP68, 23.88 MM, 3.56 MM HEIGHT, CERAMIC, QFP-68

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WED8LM32129C-55EIT 数据手册

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WED8LM32129C

HI-RELIABILITY PRODUCT

128Kx32 SRAM MODULE PRELIMINARY*

FEATURES

■ Access Times of 15, 17, 20, 25, 35, 45, 55ns

■ Low Power CMOS

■ Packaging

■ TTL Compatible Inputs and Outputs

■ Built in Decoupling Caps and Multiple Ground Pins for Low

• 68 lead, 23.88mm Low Profile CQFP, 3.56mm (0.140")

Noise Operation

■ Organized as 128Kx32; User Configurable as 256Kx16 or

■ Device is upgradeable to 512Kx32

512Kx8

■ Commercial, Industrial and Military Temperature Ranges

■ 5 Volt Power Supply

* This data sheet describes a product under development, not fully

characterized, and is subject to change without notice.

FIG. 1 PIN CONFIGURATION FOR WED8LM32129C-E

TOP VIEW

PIN DESCRIPTION

I/O0-31

A0-16

WE1-4

CS1-4

Data Inputs/Outputs

Address Inputs

Write Enables

Chip Selects

68 67 66 65 64 63 62 61

I/O

I/O16

I/O17

I/O18

I/O19

I/O20

I/O21

I/O22

I/O23

GND

I/O24

I/O25

I/O26

I/O27

I/O28

I/O29

I/O30

I/O31

Output Enable

Power Supply

Ground

VCC

0.940"

GND

The WEDC 68 lead CQFP fills

the same fit and function as the

JEDEC 68 lead CQFJ or 68

PLCC. But the CQFP has the

TCE and lead inspection

GND

Not Connected

I/O

I/O10

I/O11

I/O12

I/O13

I/O14

I/O15

advantage of the CQFP form.

27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43

BLOCK DIAGRAM

WE₁CS₁

WE₂CS₂

WE₃CS₃

WE₄CS₄

0-16

128K x 8

I/O16-23

I/O24-31

I/O0-7

I/O8-15

July 1999 Rev. 0

White Electronic Designs Corporation • (602) 437-1520 • www.whitedc.com

12 3 4 5 6

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