Datasheet > WDM610N170LS

WDM610N170LS

更新时间： 2024-11-25 14:48:55

品牌	Logo	应用领域
先科 - SWST		晶体
页数	文件大小	规格书
7页	584K
描述
功率金氧半电晶体

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中文翻译

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数据手册

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WDM610N170LS 数据手册

WDM610N170LS-HAF

Dual N-Channel Enhancement Mode MOSFET

Features

• Low R_DS(ON)

• Fully Characterized Capacitance and Avalanche

• Halogen and Antimony Free(HAF),

RoHS compliant

Application

Q1:1.Source 2.Gate 7.Drain 8.Drain

Q2:3.Source 4.Gate 5.Drain 6.Drain

DFN5060 Plastic Package

• Synchronous Rectification

• BLDC Motor drive applications

• Battery powered circuits

Key Parameters(Q1/Q2)

Parameter

BV_DSS

Value

100

Unit

21 @ V_GS= 10 V

26 @ V_GS= 4.5 V

1.9

R_DS(ON)Max

mΩ

V_GS(th)typ

Q_gtyp

22 @ V_GS= 10 V

Absolute Maximum Ratings (at T_a= 25℃ unless otherwise specified)(Q1\Q2)

Parameter

Symbol

V_DS

Value

100

Unit

Drain-Source Voltage

Gate-Source Voltage

V_GS

± 20

T_c= 25℃

T_c= 100℃

Continuous Drain Current

I_D

Peak Drain Current, Pulsed ¹⁾

Avalanche Current

I_DM

I_AS

130

17.4

Single Pulse Avalanche Energy ²⁾

E_AS

℃

Power Dissipation

P_tot

39.4

T_c= 25℃

Operating Junction and Storage Temperature Range

T_J, T_stg

- 55 to + 175

Thermal Characteristics(Q1\Q2)

Parameter

Symbol

R_θJC

Max.

3.8

Unit

Thermal Resistance from Junction to Case

Thermal Resistance from Junction to Ambient ³⁾

¹⁾Pulse Test: Pulse Width ≤ 100 μs, Duty Cycle ≤ 2%, Repetitive rating, pulse width limited by junction temperature T_J(MAX)=175°C.

²⁾Limited by T_J(MAX), starting T_J= 25 °C, L = 0.1 mH, R_g= 25 Ω, I_AS= 17.4 A, V_GS= 10 V.

℃

R_θJA

³⁾Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate in still air.

1 / 7

Dated: 15/06/2023 Rev: 04

12 3 4 5 6 7

中文翻译

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