Datasheet > WCI2012CP2N2J

WCI2012CP2N2J

更新时间： 2024-10-29 16:59:15

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	952K
描述
SMD Wire Wound Ceramic Chip RF Inductor / WCI Series 2.2, 35, 600mA

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WCI2012CP2N2J 数据手册

13. Reliability Performance

Reliability Experiment For Electrical

Test Item

Accept criteria

Test Condition

Standard Source

1.Change from an initial

value L:within±5%

2.no visible damage.

1.Change from an initial

value L:within±5%

2.no visible damage.

1.Change from an initial

value L:within±5%

MIL-STD-202H

Method 103

Test Condition B

+40℃± 2℃, humidity of 90% ±5% (total 96

hours).

Humidity Test

1.Temperature: +125℃±2℃.

2.Test time: 72±2hrs.

High Temperature

Test

IEC 68-2

Test Condition B

1.Temperature: -25℃±2℃.

2.Test time: 72±2hrs.

Low Temperature

Test

IEC 68-2

Test Condition A

2.no visible damage.

Reference

MIL-STD-202H

Method 107

Test Condition B-2

Reference

MIL-STD-202H

Method 108

Test Condition B

+125℃±5℃ (30 minutes) ~ -65±5℃ (30

minutes), temperature switch time: 5 minutes

(total 50 cycles).

1.Change from an initial

value L:within±5%

2.no visible damage.

Thermal Shock

Life Test

1.Change from an initial

value L:within±5%

2.no visible damage.

+70℃±5℃ (250Hours).

Reliability Experiment For Physical

Test Item

Accept criteria

Test Condition

Standard Source

1.Change from an initial

value L:within±5%

2.no visible damage.

10-55-10HZ, amplitude: 1.5mm, direction: X, Y, Z MIL-STD-202H

Vibration Test

axes, each axis 2 hours (total 6 hours).

Method 201

Reference

IR/convection reflow: Peak Temp 250±5℃ for

30±5Sec. in air, Through 3 Cycle. Temperature

Ramp:+1~4°C/sec.; Above 183°C, must keep 90 s

- 120 s.

MIL-STD-202H

Method 210

Test Condition K

(Reflow)

Solder Heat

Resistance Test

1.no visible damage.

Solder temp: 245±5℃,

Immersion time: 5 second.

Immersion rate: 25±6mm/sec.

1. Lead must have 95%

above coverage.

J-STD-002D

Test condition B1

Solder Ability Test

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