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WCA1608CP6N1J PDF预览

WCA1608CP6N1J

更新时间: 2024-10-29 16:59:15
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华新科技 - WALSIN /
页数 文件大小 规格书
8页 968K
描述
SMD Wire Wound Ceramic Chip RF Inductor (AEC-Q200) / WCA Series 6.1, 25, 700mA

WCA1608CP6N1J 数据手册

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10. Reliability Performance  
Test Item  
Accept criteria  
Test Condition  
Standard Source  
1000 hrs. at rated operating temperature (e.g.  
125°C part can be stored for 1000 hrs. @ 125°C.  
Same applies for 105°C and 85°C. Unpowered.  
Measurement at 24±4 hours after test conclusion.  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
High Temperature  
Exposure (Storage)  
AEC-Q200 RevD  
Table 5  
1000 cycles (-40°C to +125°C). Note: If 85°C part or  
105°C part the 1000 cycles will be at that  
temperature. Measurement at 24±4 hours after  
test conclusion. 30min maximum dwell time at  
each temperature extreme. 1 min. maximum  
transition time.  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
AEC-Q200 RevD  
Table 5  
Temperature Cycling  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
1000 hours 85°C/85%RH. Unpowered.  
Measurement at 24±4 hours after test conclusion. Table 5  
AEC-Q200 RevD  
Biased Humidity  
Operational Life  
1.Change from an initial 1000 hrs. @ 105°C. If 85°C or 125°C part will be  
value L:within±5%  
2.no visible damage.  
AEC-Q200 RevD  
Table 5  
tested at that temperature. Measurement at 24±4  
hours after test conclusion.  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
MIL-STD-202  
Method 213  
Condition C  
Peak Value: 100g’s, Duration: 6ms, Waveform:  
Half-sine Velocity Change: 12.3ft/sec.  
Mechanical Shock  
Vibration  
5g's for 20 minutes, 12 cycles each of 3  
orientations.  
Note: Use 8"X5" PCB, .031" thick, 7 secure points  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
AEC-Q200 RevD  
on one long side and 2 secure points at corners of Table 5  
opposite sides. Parts mounted within 2" from any  
secure point. Test from 10-2000 Hz.  
Condition K: Reflow temp:250±5,  
Peak time: 30±5sec, Temp ramp: 1°C/s-4°C/s; time  
above 183°C, 90 s - 120 s, Cycles: 3.  
Resistance to  
Soldering Heat  
MIL-STD-202  
Method 210  
1.no visible damage.  
1.Change from an initial  
value L:within±5%  
2.no visible damage.  
AEC-Q200-002  
Or  
ISO/DIS10605  
Passive Component Human Body Model (HBM)  
direct contact discharge 8KV.  
ESD  
1. Lead must have 95%  
above coverage.  
AEC-Q200 RevD  
Table 5  
SMD: a) Method B, 4hrs@155dry heat, @235℃  
Solder ability  
Flammability  
1.Meet UL-94 V0 or V1  
request  
V-0 or V-1 Acceptable.  
UL-94  
1.Change from an initial 100mmX40mm board mechanical means to apply  
Board Flex  
value L:within±5%  
a force which will bend the board (D) x = 2 mm  
AEC-Q200-005  
AEC-Q200-006  
2.no visible damage.  
minimum, applied forces shall be 60 (+ 5) Sec.  
Terminal Strenh  
(SMD)  
1.Component can’t drop  
2.no visible damage.  
1.8Kg force, applied for 60 second.  
Page 8 of 8  

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