Datasheet > WAVE-ANC2

WAVE-ANC2

更新时间： 2024-11-05 22:58:51

品牌	Logo	应用领域
其他 - ETC		/
页数	文件大小	规格书
12页	1065K
描述
ASSEMBLY SOLDER ANCHOR

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中文翻译

获取价格

数据手册

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WAVE-ANC2 数据手册

Wave Series Heat Sink with Integrated Clip Assembly

BGA Heat Sinks

The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which

limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique

clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The

clipping mechanism allows for easy installation in high production assembly.

Features & Benefits

•

Approximately 12% better thermal performance than traditional footprint heat sinks

Height- A low profile design allows for more surface area in a height restricted

application

•

Clipping mechanism included with heat sink

Surface Area- Fin array allows for more surface area for forced convection

Easily customizable

Easily compatible with major BGA device manufacturers components such as:

Broadcomm, Motorola, Freescale, TI, Intel, etc.

Material Specifications

•

Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish.

Spring Clip: 304 Stainless Steel, 1.2mm [0.47"] DIA

RoHS Compliant

Mechanical Dimensions (mm)

Thermal

Resistance -

Surface Area Height Off Base Forced Conv.

WkV Part

Number

Attachment

Method

Fin

Description

Length Width Width Height

(sq mm)

6055.1

7634.6

8305.2

(Fin Height)

10.5

14.5

@ 200 LFM

6.76

5.08

5.21

4.08

4.64

2.19

3.83

3.63

3.15

2.11

2.55

3.36

3.16

3.40

2.96

WAVE-23-125

WAVE-23-165

WAVE-26-12

WAVE-29-127

WAVE-32-12

WAVE-34-21

WAVE-35-12

WAVE-35-125

WAVE-35-15

WAVE-35-21

WAVE-366-175

WAVE-40-12

WAVE-40-125

WAVE-425-117

WAVE-45-12

Spring-Anchor 23

Spring-Anchor 26

Spring-Anchor 29

Spring-Anchor 32

Spring-Anchor 34

Spring-Anchor 35

Spring-Anchor 36.6 36.6

Spring-Anchor 40

Spring-Anchor 42.5 42.5

Spring-Anchor 45 45

12.5

16.5

12.7

12.5

17.5

12.5

11.7

Wave Heat Sink BGA Chipset Aluminum Top Mount

46.5

52.9

61.4

50.2

11810.5

10957.5

21268.4

15180.8

15792.6

15612.7

21721.8

18637.8

17689.4

18410.1

21668.3

22303.7

10.7

10.5

15.5

10.5

9.3

63.3

58.1

74.6

63.6

66.9

68.3

67.4

WAVE-ANC1 ANCHOR, PCB, 10MM TALL

WAVE-ANC2 ASSEMBLY , SOLDER ANCHOR

12 3 4 5 6 7...12

中文翻译

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与WAVE-ANC2相关器件

型号	品牌	获取价格	描述	数据表
WAVEJET 334 TOUCH	TELEDYNE	获取价格	DGTL O-SCOPE 350MHZ 4CH 2GS/S
WAVEJET 354 TOUCH	TELEDYNE	获取价格	DGTL O-SCOPE 500MHZ 4CH 2GS/S
WAVESURFER 10	TELEDYNE	获取价格	DGTL O-SCOPE 1GHZ 10GS/S 4CH
WAVESURFER 10M	TELEDYNE	获取价格	1 GHZ, 10 GS/S, 4 CH, 16 MPTS/CH
WAVESURFER 510	TELEDYNE	获取价格	1 GHZ OSCILLOSCOPE, 10 GS/S, 4 C
WAVESURFER 510 DK PACK	TELEDYNE	获取价格	OSCOPE 1GHZ W/FREE SOFTWARE PACK
WB0130KRM	WILLAS	获取价格	100mA Surface Mount Schottky Barrier Rectifiers - 30V
WB0130QRL	WILLAS	获取价格	100mA Surface Mount Schottky Barrier Rectifiers - 30V
WB05	ETC	获取价格	Analog Buffer/Voltage Follower
WB0610-301Y	RFE	获取价格	THRU-HOLE INDUCTORS BDC & WB Series: Beads & Chokes

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