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W764M32V1-110BM PDF预览

W764M32V1-110BM

更新时间: 2024-11-20 15:57:55
品牌 Logo 应用领域
玛居礼 - MERCURY /
页数 文件大小 规格书
17页 927K
描述
Flash, 64MX32, 110ns, PBGA107, 14 X 17 MM, 1 MM PITCH, PLASTIC, BGA-107

W764M32V1-110BM 技术参数

生命周期:Contact Manufacturer包装说明:BGA,
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.32.00.51风险等级:5.74
Base Number Matches:1

W764M32V1-110BM 数据手册

 浏览型号W764M32V1-110BM的Datasheet PDF文件第2页浏览型号W764M32V1-110BM的Datasheet PDF文件第3页浏览型号W764M32V1-110BM的Datasheet PDF文件第4页浏览型号W764M32V1-110BM的Datasheet PDF文件第5页浏览型号W764M32V1-110BM的Datasheet PDF文件第6页浏览型号W764M32V1-110BM的Datasheet PDF文件第7页 
W764M32V1-XBX  
256MB – 64Mx32 NOR Flash Multi-Chip Package 3V Page Mode Memory  
FEATURES  
GENERAL DESCRIPTION  
The W764M32V1-XBX device is a 3V single power ash memory.  
The device utilizes two chips organized as 67,108,864 words. The  
device has a 32-bit wide data bus and can be user dened as 2  
ranks of 64M x 16-bit data.  
 Single power supply operation  
• 3 Volt read, erase, and program operations  
 I/O Control  
• Wide I/O voltage range (VIO): 1.8V to VCC  
Each device requires a single 3 volt power supply for both read  
and write functions.  
• All input levels (address, control, and DQ input levels)  
and outputs are determined by voltage on VIO input.  
*This product is subject to change without notice.  
 Separate 1024-byte One Time Program (OTP) array with  
two lockable regions  
 Uniform sector architecture  
• One thousand twenty four 128 Kbyte sectors  
 100,000 erase cycles per sector typical  
 20-year data retention typical  
 Commercial, industrial and military temperature ranges  
 Organized as 64M x 32, user congurable as 2 ranks of  
64M x 16  
PERFORMANCE CHARACTERISTICS  
 High Performance  
• 110, 120 ns  
• 32-byte page read buffer  
• 15, 20 ns page read times  
• 512-byte write buffer reduces overall programming time  
for multiple-word updates  
 Package option  
• 107 BGA, 14mm x 17mm  
• 1.0mm pitch  
 Footprint compatible with W764M32V-XSBX  
 Upgradeable to 2 x 64M x 32 and to 4 x 64M x 32 in same  
footprint  
 Software features  
• Suspend and resume commands for program and erase  
operations  
• Data# polling and toggle bits provide status  
• CFI (Common Flash Interface) parameter table  
 Hardware features  
• Advanced Sector Protection (ASP)  
• Hardware reset input (RESET#) resets device  
• Status Register, data polling, and ready/busy pin methods  
to determine device status.  
Microsemi Corporation reserves the right to change products or specications without notice.  
November 2015 © 2015 Microsemi Corporation. All rights reserved.  
Rev. 5  
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp  

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