Datasheet > W3H32M72E-667BI

W3H32M72E-667BI

更新时间： 2024-11-12 07:14:15

品牌	Logo	应用领域
玛居礼 - MERCURY		动态存储器双倍数据速率
页数	文件大小	规格书
23页	1040K
描述
DDR DRAM, 32MX72, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208

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W3H32M72E-667BI 数据手册

W3H32M72E-XBX

W3H32M72E-XBXF

256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

FEATURES

BENEFITS

 Data rate = 667, 533, 400 Mb/s

 36% space savings vs. FPBGA

 Package:

 Reduced part count

• 208 Plastic Ball Grid Array (PBGA), 16 x 20mm

• 1.0mm pitch

 50% I/O reduction vs FPBGA

 Reduced trace lengths for lower parasitic capacitance

 Suitable for hi-reliability applications

 Upgradable to 64M x 72 density

• Moisture Sensitivity Level (MSL): 3

 Single 1.8V supply

 Differential data strobe (DQS, DQS#) per byte

 Internal, pipelined, double data rate architecture

 4-bit prefetch architecture

 Lead free - available (Pb free – component and material are

lead free in accordance with IPC-1752)

* This product is subject to change without notice.

 DLL for alignment of DQ and DQS transitions with clock

signal

 Four internal banks for concurrent operation

(Per DDR2 SDRAM Die)

TYPICAL APPLICATION

 Programmable Burst lengths: 4 or 8

 Auto Refresh and Self Refresh Modes

 On Die Termination (ODT)

 Adjustable data – output drive strength

 Programmable CAS latency: 3, 4, 5, 6 or 7

 Posted CAS additive latency: 0, 1, 2, 3, 4, 5 or 6

 Write latency = Read latency - 1* t_CK

 Commercial, Industrial and Military Temperature Ranges

 Organized as 32M x 72

RAM

DDR2/DDR3

W3H32M72E-XBI

Host

FPGA/

Processor

SSD (SLC)

MSM32/MSM64 (SATA BGA)

W7N16GVHxxBI (PATA BGA)

M512/M256/M128 (SATA, 2.5in)

 Weight: W3H32M72E-XBX - 2.5 grams typical

FIGURE 1 – DENSITY COMPARISONS

CSP Approach (mm)

W3H32M72E-XBX

FBGA

12.5

W3H32M72E-XBX

Area

5 x 100mm²= 500mm²

5 x 84 balls = 420 balls

320mm²

36%

50%

I/O Count

208 Balls

Microsemi Corporation reserves the right to change products or speciﬁcations without notice.

Rev. 2

Microsemi Corporation • (602) 437-1520 • www.microsemi.com/pmgp

12 3 4 5 6 7...23

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与W3H32M72E-667BI相关器件

型号	品牌	获取价格	描述	数据表
W3H32M72E-667BM	MERCURY	获取价格	DDR DRAM, 32MX72, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M72E-667BMF	MERCURY	获取价格	DDR DRAM, 32MX72, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, LEAD FREE, PLATSIC, BGA-2
W3H32M72E-667ES	WEDC	获取价格	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-667ESC	WEDC	获取价格	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-667ESI	WEDC	获取价格	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-667ESM	WEDC	获取价格	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-667SB	WEDC	获取价格	32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-667SB2C	WEDC	获取价格	DDR DRAM, 32MX72, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M72E-667SB2C	MICROSEMI	获取价格	DDR DRAM, 32MX72, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H32M72E-667SB2CF	MICROSEMI	获取价格	DDR DRAM, 32MX72, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-20

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