Datasheet > W3H128M72E2-533NBC

W3H128M72E2-533NBC

更新时间： 2024-11-10 04:45:43

品牌	Logo	应用领域
WEDC		动态存储器双倍数据速率
页数	文件大小	规格书
32页	988K
描述
DDR DRAM, 128MX72, 0.5ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208

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W3H128M72E-XSBX

White Electronic Designs

128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

FEATURES



Data rate = 667, 533, 400



CK/CK# Termination options available

• 0 ohm, 20 ohm



Package:

• 208 Plastic Ball Grid Array (PBGA), 16 x 22mm

• 1.0mm pitch



Posted CAS additive latency: 0, 1, 2, 3 or 4

Write latency = Read latency - 1* t_CK



Core Supply Voltage = 1.8V ± 0.1V

Commercial, Industrial and Military Temperature

Ranges

I/O Supply Voltage = 1.8V ± 0.1V - (SSTL_18

compatible)



Organized as 128M x 72



Differential data strobe (DQS, DQS#) per byte

Internal, pipelined, double data rate architecture

4-bit prefetch architecture

Weight: W3H128M72E-XSBX - 4 grams max

BENEFITS



56% space savings vs. FBGA

DLL for alignment of DQ and DQS transitions with

clock signal

Reduced part count

50% I/O reduction vs FBGA



Eight internal banks for concurrent operation

(Per DDR2 SDRAM Die)

Reduced trace lengths for lower parasitic

capacitance



Programmable Burst lengths: 4 or 8

Auto Refresh and Self Refresh Modes

On Die Termination (ODT)



Suitable for hi-reliability applications

Thinner "NB" version of part is under development.

Only difference in the part will be the thickness is

3.97mm (0.156) max, a reduction of .68mm (.027)

Adjustable data – output drive strength

Programmable CAS latency: 4, 5 or 6

* This product is subject to change without notice.

FIGURE 1 – DENSITY COMPARISONS

CSP Approach (mm)

W3H128M72E-XSBX

11.5

White Electronic Designs

FBGA

14.0

W3H128M72E-XSBX

FBGA

Area

5 x 161mm²= 805mm²

5 x 84 balls = 420 balls

352mm²

56%

50%

I/O

Count

208 Balls

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

September 2009

Rev. 6

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7...32

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与W3H128M72E2-533NBC相关器件

型号	品牌	获取价格	描述	数据表
W3H128M72E2-533NBI	MERCURY	获取价格	DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, BGA-208
W3H128M72E-2533SBM	WEDC	获取价格	DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H128M72E2-667NBI	WEDC	获取价格	DDR DRAM, 128MX72, 0.5ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H128M72E2-667NBM	MERCURY	获取价格	DDR DRAM, 128MX72, 1.25ns, CMOS, PBGA208, BGA-208
W3H128M72E2-667SBM	MERCURY	获取价格	DDR DRAM, 128MX72, 1.25ns, CMOS, PBGA208, BGA-208
W3H128M72E-400NBI	WEDC	获取价格	DDR DRAM, 128MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H128M72E-400NBM	MERCURY	获取价格	DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, BGA-208
W3H128M72E-400NBM	MICROSEMI	获取价格	DDR DRAM, 128MX72, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H128M72E-400SBC	WEDC	获取价格	DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
W3H128M72E-400SBI	WEDC	获取价格	DDR DRAM, 128MX72, 1.35ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208

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