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VSC8221HH PDF预览

VSC8221HH

更新时间: 2024-02-19 13:06:34
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网(LAN)标准以太网:16GBASE-T电信电信集成电路
页数 文件大小 规格书
138页 1143K
描述
Single Port 10/100/1000BASE-T PHY with1.25 Gbps SerDes for SFPs/GBICs

VSC8221HH 技术参数

生命周期:Active包装说明:TFBGA-100
Reach Compliance Code:compliant风险等级:5.73
其他特性:ALSO REQUIRE 2.5, 3.3V数据速率:1000000 Mbps
JESD-30 代码:S-PBGA-B100长度:9 mm
功能数量:1端子数量:100
收发器数量:1最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA100,10X10,32
封装形状:SQUARE封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
座面最大高度:1.1 mm最大压摆率:367 mA
标称供电电压:1.2 V表面贴装:YES
电信集成电路类型:ETHERNET TRANSCEIVER温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM宽度:9 mm

VSC8221HH 数据手册

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VSC8221  
Data Sheet  
Microsemi Corporate Headquarters  
One Enterprise, Aliso Viejo, CA 92656 USA  
Within the USA: +1 (800) 713-4113 Outside the USA: +1 (949) 380-6100 Fax: +1 (949) 215-4996 Email: sales.support@microsemi.com  
www.microsemi.com  
© 2004–2006, 2018 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation.  
All other trademarks and service marks are the property of their respective owners.  
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or the suitability of its products and services for any  
particular purpose, nor does Microsemi assume any liability whatsoever arising out of the application or use of any product or circuit. The products sold hereunder  
and any other products sold by Microsemi have been subject to limited testing and should not be used in conjunction with mission-critical equipment or  
applications. Any performance specifications are believed to be reliable but are not verified, and Buyer must conduct and complete all performance and other  
testing of the products, alone and together with, or installed in, any end-products. Buyer shall not rely on any data and performance specifications or parameters  
provided by Microsemi. it is the Buyer's responsibility to independently determine suitability of any products and to test and verify the same. The information  
provided by Microsemi hereunder is provided “as is, where is” and with all faults, and the entire risk associated with such information is entirely with the Buyer.  
Microsemi does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other iP rights, whether with regard to such information itself or  
anything described by such information. information provided in this document is proprietary to Microsemi, and Microsemi reserves the right to make any changes  
to the information in this document or to any products and services at any time without notice.  
About Microsemi  
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for aerospace & defense, communications, data  
center and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASiCs;  
power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF  
solutions; discrete components; enterprise storage and communication solutions, security technologies and scalable anti-tamper products; Ethernet solutions;  
Power-over-Ethernet iCs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, California, and has  
approximately 4,800 employees globally. Learn more at www.microsemi.com.  
138 of 138  
VMDS-10106 Revision 4.1  
138  
December 2006  

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