VS-CPV362M4FPbF
Vishay Semiconductors
www.vishay.com
IGBT SIP Module (Fast IGBT)
FEATURES
• Fully isolated printed circuit board mount
package
• Switching-loss rating includes all “tail” losses
• HEXFRED® soft ultrafast diodes
• Optimized for medium speed, see fig. 1 for
current vs. frequency curve
• Designed and qualified for industrial level
• UL approved file E78996
SIP (IMS-2)
PRIMARY CHARACTERISTICS
OUTPUT CURRENT IN A TYPICAL 5.0 kHz MOTOR DRIVE
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
VCES
600 V
DESCRIPTION
I
RMS per phase (3.1 kW total)
with TC = 90 °C
11 A
The IGBT technology is the key to the advanced line of IMS
(Insulated Metal Substrate) power modules. These modules
are more efficient than comparable bipolar transistor
modules, while at the same time having the simpler
gate-drive requirements of the familiar power MOSFET. This
superior technology has now been coupled to a state of the
art materials system that maximizes power throughput with
low thermal resistance. This package is highly suited to
motor drive applications and where space is at a premium.
TJ
125 °C
360 VDC
0.8
Supply voltage
Power factor
Modulation depth See fig. 1
115 %
V
CE(on) (typical)
at IC = 4.8 A, 25 °C
1.41 V
Speed
1 kHz to 8 kHz
SIP
Package
Circuit configuration
Three phase inverter
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
TEST CONDITIONS
MAX.
600
8.8
UNITS
Collector to emitter voltage
VCES
V
TC = 25 °C
C = 100 °C
Continuous collector current, each
IGBT
IC
T
4.8
Repetitive rating; VGE = 20 V,
pulse width limited by maximum
junction temperature. See fig. 20
Pulsed collector current
ICM
26
A
VCC = 80 % (VCES), VGE = 20 V,
L = 10 μH, RG = 50 See fig. 19
Clamped inductive load current
ILM
800
Diode continuous forward current
Diode maximum forward current
Gate to emitter voltage
IF
TC = 100 °C
3.4
26
IFM
VGE
VISOL
20
V
Isolation voltage
Any terminal to case, t = 1 min
TC = 25 °C
2500
23
VRMS
Maximum power dissipation, each
IGBT
PD
W
TC = 100 °C
9.1
Operating junction and
storage temperature range
TJ, TStg
-40 to +150
°C
Soldering temperature
For 10 s
300 (0.063" (1.6 mm) from case)
5 to 7
(0.55 to 0.8)
lbf · in
(N · m)
Mounting torque
6-32 or M3 screw
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
thJC (IGBT)
thJC (diode)
TYP.
MAX.
5.5
9.0
-
UNITS
°C/W
Junction to case, each IGBT, one IGBT in conduction
Junction to case, each diode, one diode in conduction
Case to sink, flat, greased surface
Weight of module
R
-
-
R
R
thCS (module)
0.1
20 (0.7)
-
g (oz.)
Revision: 25-Oct-17
Document Number: 94361
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000